10M16DAF256C8G

The 10M16DAF256C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 256-LBGA package. It integrates 16,000 logic elements and 562,176 bits of on-chip RAM to address mid-density programmable logic requirements.

With 178 user I/O pins, surface-mount packaging, and a nominal operating voltage range of 1.15 V to 1.25 V, this commercial-grade FPGA is aimed at designs that require compact integration, moderate logic capacity, and on-chip memory within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 16,000 logic elements to implement a wide range of combinational and sequential logic functions.
• On-Chip Memory — 562,176 total RAM bits for buffering, state storage, and small embedded data structures.
• I/O — 178 available I/O pins to support multiple external interfaces and peripheral connections.
• Power and Supply — Supports a supply voltage range of 1.15 V to 1.25 V for core operation.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FBGA, 17×17) optimized for surface-mount assembly.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Unique Advantages

• Substantial Logic Density: 16,000 logic elements provide the capacity needed for mid-complexity FPGA functions without external logic expansion.
• Significant On-Chip RAM: 562,176 bits of RAM reduce the need for external memory for many buffering and small-data tasks.
• High I/O Count: 178 I/O pins facilitate multiple peripheral connections and interface options within a single device.
• Compact, Surface-Mount Package: 256-LBGA (256-FBGA, 17×17) enables dense board layouts while maintaining ease of assembly.
• Low-Voltage Core Operation: 1.15 V–1.25 V supply supports low-power design considerations for the FPGA core.
• Commercial Availability: Designed for commercial-temperature deployments (0 °C to 85 °C) with RoHS compliance for modern manufacturing requirements.

Why Choose 10M16DAF256C8G?

The 10M16DAF256C8G delivers a balanced set of resources—16,000 logic elements, over half a million bits of on-chip RAM, and 178 I/O—packaged in a compact 256-LBGA footprint. Its combination of logic density, on-chip memory, and I/O capability makes it well suited to embedded designs that require moderate programmable logic capacity and integrated RAM without external memory dependence.

This commercial-grade FPGA supports designs that prioritize integration and board-space efficiency, offering a clear path for engineers focused on mid-range programmable logic implementations that operate within a 0 °C to 85 °C environment. RoHS compliance and surface-mount packaging ease manufacturing and regulatory alignment for mainstream production.

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