10M16DAF484C7G

The 10M16DAF484C7G is a MAX® 10 field programmable gate array (FPGA) from Intel providing 16,000 logic elements, 562,176 total RAM bits and 320 user I/O pins in a compact 484-FBGA (23×23) package. It is offered as a commercial-grade, surface-mount FPGA for embedded and system-level designs requiring mid-range logic and memory resources.

Operating from a 1.15 V to 1.25 V supply and rated for 0 °C to 85 °C, this RoHS-compliant device targets applications where integration of programmable logic, on-chip RAM, and a high I/O count simplifies board-level design and reduces component count.

Key Features

• Logic Capacity: 16,000 logic elements available to implement custom digital logic, state machines, and control functions.
• On-Chip Memory: 562,176 total RAM bits to support buffering, lookup tables, and small data stores without external memory.
• I/O Count: 320 user I/O pins to provide extensive connectivity for peripherals, sensors, and high-density interfaces.
• Power Supply: Operates from a 1.15 V to 1.25 V supply range for core power.
• Package & Mounting: 484-FBGA (23×23) package in a surface-mount form factor for compact PCB layouts.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for standard commercial applications.
• Compliance: RoHS compliant.

Typical Applications

• Custom Logic and Acceleration: Use available logic elements to implement application-specific accelerators and control logic on a single chip.
• Interface Bridging and Protocol Conversion: High I/O count enables flexible routing and support for multiple parallel or serial interfaces without extensive external glue logic.
• Prototyping and Development: On-chip RAM and ample logic resources support rapid iteration of digital designs and proof-of-concept implementations.
• Embedded Control and I/O Management: Combine logic, memory, and many I/Os to centralize board-level control, sensor interfacing, and peripheral management.

Unique Advantages

• Substantial Logic Resources: 16,000 logic elements allow implementation of moderately complex designs without moving to larger device families.
• Generous Embedded Memory: 562,176 RAM bits reduce reliance on external memory for buffering and small-data storage, simplifying BOM and layout.
• High Connectivity: 320 I/Os provide flexibility for multi-interface designs, reducing the need for additional I/O expanders.
• Compact BGA Package: 484-FBGA (23×23) enables a dense PCB footprint while maintaining accessibility to many I/O signals.
• Commercial-Grade Specification: 0 °C to 85 °C operating range aligns with standard commercial product requirements.
• Regulatory Compliance: RoHS compliance supports eco-conscious manufacturing and procurement requirements.

Why Choose 10M16DAF484C7G?

The 10M16DAF484C7G combines a balanced set of logic, memory, and I/O resources in a compact 484-FBGA package, making it a practical choice for designers who need mid-range FPGA capability with strong on-chip RAM and extensive connectivity. Its commercial temperature rating and RoHS compliance make it suitable for mainstream embedded and system applications.

This device is well suited for teams looking to consolidate board-level functions into a single programmable device, speed development cycles with on-chip resources, and maintain a compact PCB design while preserving flexibility for interface-rich applications.

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