10M16DAF484I6G

The 10M16DAF484I6G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 484-ball BGA (23×23) package. It integrates 16,000 logic elements, a substantial on‑chip RAM resource, and up to 320 I/O pins in a surface-mount footprint targeted for industrial-grade embedded designs.

With a nominal core supply range of 1.15 V to 1.25 V and an industrial operating temperature range of −40 °C to 100 °C, this device is suited for applications that require moderate logic capacity, significant RAM, and a dense I/O count in a compact BGA package.

Key Features

• Logic Capacity – 16,000 logic elements for implementing custom combinational and sequential logic functions without external ASICs.
• On‑chip Memory – 562,176 total RAM bits to support buffering, lookup tables, and embedded data storage within the FPGA fabric.
• I/O Resources – 320 user I/O pins to interface with sensors, peripherals, high‑density connectors, and external devices.
• Power Supply – Core voltage supply specified between 1.15 V and 1.25 V for the device core operation.
• Package & Mounting – 484‑ball FBGA (23×23) package in a surface-mount form factor for compact board integration.
• Industrial Grade – Rated operating temperature from −40 °C to 100 °C suitable for industrial environments.
• Regulatory Compliance – RoHS compliant, meeting common lead‑free assembly requirements.

Typical Applications

• Industrial Control – Use the device’s 16,000 logic elements and industrial temperature rating for PLC functions, I/O aggregation, and control logic in factory automation systems.
• Embedded Processing – Leverage the on‑chip 562,176 RAM bits and 320 I/O for buffering, protocol bridging, and custom peripheral interfaces in embedded platforms.
• Communications & Gateway – Dense I/O and configurable logic enable protocol conversion, multiplexing, and custom packet processing at the edge.

Unique Advantages

• Balanced Logic and Memory: 16,000 logic elements combined with over 562k RAM bits provide a strong balance for logic‑intensive functions that also require embedded data storage.
• High I/O Density: 320 user I/Os support complex external interfacing without immediate need for additional I/O expanders, simplifying board design.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C helps ensure stable behavior in harsher environments common to industrial applications.
• Compact BGA Package: The 484‑FBGA (23×23) package enables a high pin count in a small PCB footprint, aiding space-constrained designs.
• Low‑level Power Specification: A defined core supply range of 1.15 V to 1.25 V assists power budgeting and system-level power sequencing.
• RoHS Compliant: Meets lead‑free manufacturing requirements for modern electronic assembly.

Why Choose 10M16DAF484I6G?

The 10M16DAF484I6G positions itself as a compact, industrial‑grade FPGA option for designs that require mid-range logic capacity, substantial on‑chip RAM, and a high number of user I/Os. Its 484‑ball BGA package and surface‑mount form factor make it practical for space‑constrained PCBs while supporting complex interfacing needs.

This device is appropriate for engineers and procurement teams building embedded systems, industrial controllers, and communication gateways where a verified operating temperature range, RoHS compliance, and clear electrical supply requirements are important for system integration and long‑term deployment.

If you would like pricing, availability, or a formal quote for 10M16DAF484I6G, submit a request or inquiry and our team will respond with the details you need to proceed.