10M16DAF256I7G

The 10M16DAF256I7G is a MAX® 10 field programmable gate array (FPGA) offered in a 256-ball LBGA package. It delivers 16,000 logic elements, 562,176 total RAM bits and up to 178 I/O pins, making it suitable for space-constrained embedded and industrial applications requiring reconfigurable logic and on-chip memory.

Designed for surface-mount assembly and industrial temperature operation from -40 °C to 100 °C, this device supports low-voltage systems with a supply range of 1.15 V to 1.25 V while meeting RoHS compliance for environmental requirements.

Key Features

• Core Logic 16,000 logic elements provide programmable logic capacity for custom control, glue logic, and hardware acceleration tasks.
• Embedded Memory 562,176 total RAM bits allow on-chip data buffering, small FIFOs, and state storage without external memory.
• I/O Density Up to 178 general-purpose I/O pins enable broad signal interfacing options for sensors, buses, and external peripherals.
• Power and Voltage Operates from 1.15 V to 1.25 V supply rails to suit low-voltage system designs.
• Package 256-LBGA package; supplier device package listed as 256-FBGA (17×17) for compact board-level integration.
• Temperature and Reliability Industrial operating range of -40 °C to 100 °C for deployment in demanding environments.
• Mounting and Compliance Surface-mount device with RoHS compliance for modern assembly and environmental standards.

Typical Applications

• Industrial Automation Implement custom control logic, protocol bridging and real-time I/O aggregation using on-chip logic and memory while meeting industrial temperature requirements.
• Embedded Systems Integrate peripheral interfaces and application-specific logic in a compact 256-ball BGA package for space-constrained boards.
• Communications and Networking Use available I/O and embedded RAM for packet buffering, protocol handling, and glue logic between subsystems.
• Instrumentation and Test Equipment Build responsive user interfaces, data acquisition front-ends, or signal preprocessing blocks leveraging programmable logic and local RAM.

Unique Advantages

• Balanced Logic and Memory: 16,000 logic elements paired with 562,176 RAM bits supports a wide range of mid-density designs without immediate need for external memory.
• High I/O Count: Up to 178 I/O pins provide flexibility to connect multiple sensors, buses and peripherals directly to the FPGA fabric.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Compact Package: 256-LBGA (supplier package 256-FBGA 17×17) enables high-density PCB implementations while preserving routing efficiency.
• Low-Voltage Operation: 1.15 V to 1.25 V supply support aligns with modern low-power system architectures.
• RoHS Compliant: Meets environmental requirements for lead-free assembly processes.

Why Choose 10M16DAF256I7G?

The 10M16DAF256I7G positions itself as a mid-density, industrial-grade FPGA that balances programmable logic capacity, substantial on-chip RAM and high I/O pin count in a compact BGA footprint. Its low-voltage operation and RoHS compliance make it suitable for modern embedded and industrial designs that require reconfigurable logic and dependable thermal performance.

This device is ideal for engineers and procurement teams building control systems, embedded appliances, test equipment, or communication interfaces who need a single-chip programmable solution with predictable electrical and thermal characteristics and a compact package for board-level integration.

Request a quote or submit an RFQ today to get pricing and availability for the 10M16DAF256I7G and accelerate your design cycle.