10M16DAF256C7G

IC FPGA 178 I/O 256FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 562176 16000 256-LBGA

Quantity 1,542 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O178Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells16000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits562176

Overview of 10M16DAF256C7G – MAX® 10 Field Programmable Gate Array, 16,000 logic elements, 256‑LBGA

The 10M16DAF256C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) IC supplied in a 256‑ball LBGA package. It integrates 16,000 logic elements and 562,176 bits of on‑chip RAM, supporting designs that require moderate logic capacity with substantial embedded memory.

This device is a surface‑mount, commercial‑grade FPGA with 178 general‑purpose I/O, a supply voltage range of 1.15 V to 1.25 V, and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

  • Core Logic  16,000 logic elements provide the primary programmable fabric for custom logic implementation and signal processing.
  • On‑Chip Memory  562,176 total RAM bits for embedded data buffering, state storage, and lookup table implementation.
  • I/O Count  178 I/O pins to support parallel interfaces, control signals, and connectivity to peripherals.
  • Power  Operates from a 1.15 V to 1.25 V supply range, enabling designs that require this specific core voltage window.
  • Package & Mounting  256‑ball LBGA package (supplier device package listed as 256‑FBGA, 17×17) and surface‑mount mounting for compact board integration.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for regulatory and environmental requirements.

Unique Advantages

  • Balanced logic and memory resources: The combination of 16,000 logic elements and 562,176 RAM bits supports mixed logic and buffering requirements within a single FPGA.
  • Generous I/O complement: 178 I/O pins provide flexibility for interfacing multiple peripherals or parallel buses without external multiplexing.
  • Compact surface‑mount package: The 256‑ball LBGA (256‑FBGA, 17×17) enables high‑density PCB layouts while preserving a sizable feature set.
  • Controlled supply window: 1.15 V to 1.25 V core supply simplifies power‑rail design for systems targeting that voltage range.
  • Commercial grade suitability: Rated for 0 °C to 85 °C operation for typical commercial and embedded applications.
  • Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10M16DAF256C7G?

The 10M16DAF256C7G positions itself as a mid‑capacity MAX® 10 FPGA option that combines substantial logic resources, a large on‑chip RAM footprint, and a wide complement of I/O in a compact surface‑mount package. Its defined supply range and commercial temperature rating make it suitable for designs that require predictable electrical and environmental operating points.

Engineers seeking a single‑device solution to implement moderate‑complexity logic, embedded memory functions, and multiple external interfaces will find the device’s integration and package choices helpful for streamlined board design and BOM consolidation.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the 10M16DAF256C7G.

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