10M16DAF256C7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 178 562176 16000 256-LBGA |
|---|---|
| Quantity | 1,542 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 16000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 562176 |
Overview of 10M16DAF256C7G – MAX® 10 Field Programmable Gate Array, 16,000 logic elements, 256‑LBGA
The 10M16DAF256C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) IC supplied in a 256‑ball LBGA package. It integrates 16,000 logic elements and 562,176 bits of on‑chip RAM, supporting designs that require moderate logic capacity with substantial embedded memory.
This device is a surface‑mount, commercial‑grade FPGA with 178 general‑purpose I/O, a supply voltage range of 1.15 V to 1.25 V, and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.
Key Features
- Core Logic 16,000 logic elements provide the primary programmable fabric for custom logic implementation and signal processing.
- On‑Chip Memory 562,176 total RAM bits for embedded data buffering, state storage, and lookup table implementation.
- I/O Count 178 I/O pins to support parallel interfaces, control signals, and connectivity to peripherals.
- Power Operates from a 1.15 V to 1.25 V supply range, enabling designs that require this specific core voltage window.
- Package & Mounting 256‑ball LBGA package (supplier device package listed as 256‑FBGA, 17×17) and surface‑mount mounting for compact board integration.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for regulatory and environmental requirements.
Unique Advantages
- Balanced logic and memory resources: The combination of 16,000 logic elements and 562,176 RAM bits supports mixed logic and buffering requirements within a single FPGA.
- Generous I/O complement: 178 I/O pins provide flexibility for interfacing multiple peripherals or parallel buses without external multiplexing.
- Compact surface‑mount package: The 256‑ball LBGA (256‑FBGA, 17×17) enables high‑density PCB layouts while preserving a sizable feature set.
- Controlled supply window: 1.15 V to 1.25 V core supply simplifies power‑rail design for systems targeting that voltage range.
- Commercial grade suitability: Rated for 0 °C to 85 °C operation for typical commercial and embedded applications.
- Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.
Why Choose 10M16DAF256C7G?
The 10M16DAF256C7G positions itself as a mid‑capacity MAX® 10 FPGA option that combines substantial logic resources, a large on‑chip RAM footprint, and a wide complement of I/O in a compact surface‑mount package. Its defined supply range and commercial temperature rating make it suitable for designs that require predictable electrical and environmental operating points.
Engineers seeking a single‑device solution to implement moderate‑complexity logic, embedded memory functions, and multiple external interfaces will find the device’s integration and package choices helpful for streamlined board design and BOM consolidation.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the 10M16DAF256C7G.

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