10M08SCU324C8G

The 10M08SCU324C8G is an Intel MAX® 10 family FPGA offered in a 324-LFBGA package. It integrates up to 8,000 logic elements with 387,072 bits of on-chip RAM and supports 246 user I/O pins, providing a mid-range programmable logic resource set for commercial electronic designs.

Packaged for surface-mount assembly and rated for commercial temperature operation (0°C to 85°C), this device is suited to embedded applications that require configurable logic capacity, on-chip memory, and a high I/O count within a compact BGA footprint.

Key Features

• Logic Capacity  Provides 8,000 logic elements and 500 CLBs to implement a variety of digital logic functions and state machines.
• On‑Chip Memory  Includes 387,072 total RAM bits for buffering, lookup tables, and local data storage.
• I/O Resources  Offers 246 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Package and Mounting  Supplied in a 324-LFBGA (supplier device package: 324-UBGA, 15×15) optimized for surface-mount PCB assembly.
• Power  Operates from a 2.85 V to 3.465 V supply range to match common commercial power rails.
• Temperature and Grade  Commercial-grade device rated for 0°C to 85°C operating temperature.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Implements custom logic, glue logic, and peripheral control where mid-range logic capacity and substantial I/O are required.
• Communications and Interface Bridging  Handles protocol adaptation and I/O aggregation using its 246 available I/O pins and on-chip memory for buffering.
• User Interface and Control  Drives control logic, signal multiplexing, and front-end interfacing in consumer and commercial equipment.

Unique Advantages

• Balanced Logic and Memory  Combines 8,000 logic elements with 387,072 RAM bits to support stateful designs and local data storage without external memory in many use cases.
• High I/O Count  246 I/O pins enable flexible board-level connectivity and support for multiple parallel interfaces.
• Compact BGA Package  324-LFBGA (324-UBGA, 15×15) delivers a high-density solution suitable for space-constrained PCB layouts.
• Commercial Temperature Rating  Rated for 0°C to 85°C operation for standard commercial deployments.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly and environmental compliance.
• Surface-Mount Ready  Designed for standard surface-mount manufacturing processes.

Why Choose 10M08SCU324C8G?

The 10M08SCU324C8G delivers a practical combination of logic density, on-chip RAM, and I/O capacity in a single commercial-grade FPGA package. Its specification set—8,000 logic elements, 387,072 RAM bits, 246 I/Os, and a 324-LFBGA footprint—makes it well suited to commercial embedded designs that need flexible programmability and substantial interface capability without excessive board area.

With a defined supply voltage range (2.85 V to 3.465 V), surface-mount packaging, and RoHS compliance, this device supports standard commercial manufacturing workflows and provides a scalable option within the MAX® 10 family for developers and procurement teams focused on reliable, mid-range FPGA solutions.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the 10M08SCU324C8G. Our team will respond with current pricing and order options tailored to your project needs.