10M08SCU169I7G

IC FPGA 130 I/O 169UBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 130 387072 8000 169-LFBGA

Quantity 778 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package169-UBGA (11x11)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case169-LFBGANumber of I/O130Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs500Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits387072

Overview of 10M08SCU169I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC, 8000 logic elements, 169-LFBGA

The 10M08SCU169I7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 169-LFBGA package. It delivers 8,000 logic elements, 387,072 bits of on-chip RAM and 130 user I/Os, making it suitable for industrial applications that require configurable digital logic and on-chip memory.

Engineered for surface-mount assembly and rated for industrial operation, the device supports a nominal voltage supply range of 2.85 V to 3.465 V and an operating temperature range of -40 °C to 100 °C, providing a combination of integration and environmental robustness for deployed systems.

Key Features

  • FPGA Core  8,000 logic elements for implementing custom digital functions and control logic.
  • On-chip Memory  387,072 bits of total RAM to support buffering, state machines, and local data storage without immediate dependence on external memory.
  • I/O and Connectivity  130 user I/Os to interface with peripherals, sensors, and external buses.
  • Power  Voltage supply range from 2.85 V to 3.465 V to match common 3.3 V system rails.
  • Package & Mounting  169-LFBGA package (supplier device package: 169-UBGA, 11×11) with surface-mount mounting type for PCB assembly.
  • Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • Configurable compute density: 8,000 logic elements enable implementation of substantial on-chip logic to minimize external components and simplify board-level design.
  • Significant on-chip RAM: 387,072 bits of RAM support data buffering and local storage needs, reducing reliance on external memory subsystems.
  • Extensive I/O capability: 130 user I/Os provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA.
  • Industrial-ready thermal range: Specified -40 °C to 100 °C and industrial grade classification support deployment in harsh or temperature-variable environments.
  • Standard power compatibility: Supports a 2.85 V to 3.465 V supply window to integrate with common 3.3 V system architectures.
  • RoHS compliance: Meets environmental regulations for lead-free assembly.

Why Choose 10M08SCU169I7G?

The 10M08SCU169I7G balances on-chip logic, memory and I/O in a compact 169-LFBGA package, making it a practical choice for industrial designs that need configurable logic with built-in RAM and ample connectivity. Its voltage and temperature specifications align with standard 3.3 V systems and industrial environmental requirements, offering a dependable building block for embedded and control applications.

For teams seeking a programmable solution with clear, verifiable hardware characteristics—logic density, RAM size, I/O count, package format and industrial operating range—the 10M08SCU169I7G provides a defined platform for scalable, long-term deployments.

Request a quote or submit a price and availability inquiry today to receive tailored purchasing information for the 10M08SCU169I7G.

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