10M08SCU169I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 130 387072 8000 169-LFBGA |
|---|---|
| Quantity | 778 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-UBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LFBGA | Number of I/O | 130 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 500 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 387072 |
Overview of 10M08SCU169I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC, 8000 logic elements, 169-LFBGA
The 10M08SCU169I7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 169-LFBGA package. It delivers 8,000 logic elements, 387,072 bits of on-chip RAM and 130 user I/Os, making it suitable for industrial applications that require configurable digital logic and on-chip memory.
Engineered for surface-mount assembly and rated for industrial operation, the device supports a nominal voltage supply range of 2.85 V to 3.465 V and an operating temperature range of -40 °C to 100 °C, providing a combination of integration and environmental robustness for deployed systems.
Key Features
- FPGA Core 8,000 logic elements for implementing custom digital functions and control logic.
- On-chip Memory 387,072 bits of total RAM to support buffering, state machines, and local data storage without immediate dependence on external memory.
- I/O and Connectivity 130 user I/Os to interface with peripherals, sensors, and external buses.
- Power Voltage supply range from 2.85 V to 3.465 V to match common 3.3 V system rails.
- Package & Mounting 169-LFBGA package (supplier device package: 169-UBGA, 11×11) with surface-mount mounting type for PCB assembly.
- Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C.
- Compliance RoHS compliant.
Unique Advantages
- Configurable compute density: 8,000 logic elements enable implementation of substantial on-chip logic to minimize external components and simplify board-level design.
- Significant on-chip RAM: 387,072 bits of RAM support data buffering and local storage needs, reducing reliance on external memory subsystems.
- Extensive I/O capability: 130 user I/Os provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA.
- Industrial-ready thermal range: Specified -40 °C to 100 °C and industrial grade classification support deployment in harsh or temperature-variable environments.
- Standard power compatibility: Supports a 2.85 V to 3.465 V supply window to integrate with common 3.3 V system architectures.
- RoHS compliance: Meets environmental regulations for lead-free assembly.
Why Choose 10M08SCU169I7G?
The 10M08SCU169I7G balances on-chip logic, memory and I/O in a compact 169-LFBGA package, making it a practical choice for industrial designs that need configurable logic with built-in RAM and ample connectivity. Its voltage and temperature specifications align with standard 3.3 V systems and industrial environmental requirements, offering a dependable building block for embedded and control applications.
For teams seeking a programmable solution with clear, verifiable hardware characteristics—logic density, RAM size, I/O count, package format and industrial operating range—the 10M08SCU169I7G provides a defined platform for scalable, long-term deployments.
Request a quote or submit a price and availability inquiry today to receive tailored purchasing information for the 10M08SCU169I7G.

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