10M08SCM153C8G

The 10M08SCM153C8G is a MAX® 10 field programmable gate array (FPGA) offered in a 153-ball VFBGA package for commercial-grade applications. As a configurable logic device, it provides 8,000 logic elements, 387,072 bits of on-chip RAM and 112 I/Os, making it suitable for commercial embedded designs that require moderate logic capacity, significant on-chip memory and a high I/O count.

Key Features

• Core Architecture  MAX® 10 FPGA family device providing programmable logic resources and system-level configurability.
• Logic Capacity  8,000 logic elements to implement combinational and sequential logic functions for moderate-complexity designs.
• On-Chip Memory  387,072 total RAM bits to support buffering, data storage and memory-mapped logic functions without external memory.
• I/O Resources  112 general-purpose I/Os to interface with peripherals, sensors and external devices.
• Power Supply Range  Operates from 2.85 V to 3.465 V, accommodating typical commercial voltage rails.
• Package and Mounting  153-VFBGA package (supplier package: 153-MBGA 8×8) in a surface-mount format for compact PCB designs.
• Operating Temperature  Rated for commercial operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and environmental requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, control functions and peripheral interfacing within commercial products operating in the 0 °C to 85 °C range.
• Data Buffering and Processing  Use the on-chip RAM (387,072 bits) for temporary storage, packet buffering or intermediate data processing without immediate external memory.
• I/O-Intensive Designs  Leverage 112 I/Os for sensor arrays, user interfaces, communication ports or board-level peripheral expansion.

Unique Advantages

• Balanced Logic and Memory:  8,000 logic elements paired with 387,072 RAM bits provides a versatile mix of computation and on-chip storage for a wide range of commercial designs.
• High I/O Count:  112 I/Os simplify integration with multiple peripherals and external components, reducing the need for additional I/O expanders.
• Compact Surface-Mount Package:  The 153-VFBGA (153-MBGA 8×8) package enables high-density PCB layouts in space-constrained applications.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation to meet the environmental needs of commercial products.
• RoHS Compliance:  Conforms to RoHS directives for compatibility with lead-free manufacturing processes.

Why Choose 10M08SCM153C8G?

The 10M08SCM153C8G delivers a practical combination of logic capacity, on-chip RAM and I/O flexibility in a compact VFBGA package for commercial-grade FPGA applications. It is well suited for engineers and procurement teams seeking a configurable solution that balances integration, memory resources and interfacing capability for embedded and I/O-centric designs.

With a defined commercial operating range and RoHS compliance, this device offers a verifiable platform for product designs that need on-chip memory and moderate logic resources while maintaining a small PCB footprint.

Request a quote or submit a procurement inquiry to evaluate the 10M08SCM153C8G for your next commercial FPGA design.