10M08SCE144C8G

The 10M08SCE144C8G is an Intel MAX® 10 field programmable gate array (FPGA) provided in a 144-LQFP exposed pad package. It delivers a mid-range configurable-logic solution with 8,000 logic elements and 387,072 bits of on-chip RAM for commercial electronic designs.

With 101 I/O pins, a surface-mount 144-EQFP (20x20) supplier package, and a supply voltage range of 2.85 V to 3.465 V, this device is targeted at commercial applications that require flexible logic, on-chip memory, and a compact footprint within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity  500 logic array blocks (LABs) providing 8,000 logic elements to implement combinational and sequential logic in mid-density designs.
• On-Chip Memory  387,072 total RAM bits available for FIFOs, buffers, and local storage without external memory.
• I/O  101 general-purpose I/O pins for interfacing with peripherals, sensors, and external logic.
• Power  Operates from 2.85 V to 3.465 V supply range to match common commercial system rails.
• Package & Mounting  144-LQFP exposed pad package; supplier device package listed as 144-EQFP (20x20) and designed for surface-mount PCB assembly.
• Commercial Grade & Temperature Range  Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Commercial Embedded Control  Implement custom control logic and state machines using the 8,000 logic elements and on-chip RAM for local buffering.
• User Interfaces & Peripheral Control  Leverage 101 I/O pins to drive displays, buttons, and peripheral interfaces in equipment and appliances.
• Protocol Bridging & Glue Logic  Use the programmable fabric to translate between interfaces or consolidate discrete logic functions on a single device.

Unique Advantages

• Mid‑Density Integration:  8,000 logic elements and 387,072 RAM bits provide ample capacity for mid-range custom logic without external FPGA scale.
• Generous I/O Count:  101 I/O pins support multiple peripherals and interface channels, reducing the need for additional I/O expanders.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C operation for typical commercial product environments.
• Compact, Surface‑Mount Packaging:  144-LQFP exposed pad in a 144-EQFP (20x20) supplier package simplifies PCB integration in space-constrained designs.
• Flexible Power Range:  Operates from 2.85 V to 3.465 V, making it compatible with common board power rails.
• RoHS Compliant:  Conforms to RoHS environmental requirements for streamlined regulatory acceptance.

Why Choose 10M08SCE144C8G?

The 10M08SCE144C8G balances logic capacity, on-chip memory, and I/O density in a compact surface-mount package tailored for commercial electronic designs. Its combination of 8,000 logic elements, 387,072 bits of RAM, and 101 I/O pins provides a flexible platform for implementing control logic, interface bridging, and peripheral management without excessive board-level complexity.

Designed and manufactured by Intel and offered in a 144-LQFP exposed pad package, this device is suitable for engineers and procurement teams seeking a commercially rated, RoHS-compliant FPGA with a defined supply voltage window and temperature range for reliable integration into production products.

Request a quote or submit a pricing inquiry to check availability and lead times for the 10M08SCE144C8G. Our team can provide pricing and delivery details to support your design and procurement process.