10M08SAU324I7G

The 10M08SAU324I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) offered in a 324-LFBGA surface-mount package. This device provides 8,000 logic elements, 387,072 total RAM bits and 246 I/O, delivering a balanced combination of configurable logic, embedded memory, and high I/O capacity for a range of embedded applications.

Designed for industrial-grade operation (–40 °C to 100 °C) and RoHS compliance, the device datasheet includes detailed electrical characteristics, switching characteristics, configuration specifications, and timing parameters for system integration and design validation.

Key Features

• Logic Capacity  8,000 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  387,072 total RAM bits to support buffering, lookup tables, and on-chip data storage.
• I/O  246 available I/O pins to interface with peripherals, sensors, and external buses.
• Power  Voltage supply range of 2.85 V to 3.465 V to match common system rails.
• Package & Mounting  324-LFBGA (supplier device package: 324-UBGA, 15×15) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade  Industrial-grade device with an operating temperature range of –40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.
• Documentation  Datasheet coverage includes electrical and switching characteristics, configuration specifications, and timing for MAX 10 devices to support design and validation.

Unique Advantages

• High logic density: 8,000 logic elements enable complex logic implementation while conserving board space.
• Substantial on-chip memory: 387,072 RAM bits reduce dependence on external memory for buffering and state storage.
• Large I/O complement: 246 I/O pins facilitate multiple peripheral interfaces and parallel connections without extensive external passthroughs.
• Industrial temperature rating: –40 °C to 100 °C operation supports deployments in thermally demanding environments.
• Flexible power domain: 2.85 V to 3.465 V supply range aligns with common system voltage rails for easier power integration.
• Manufacturing-friendly package: 324-LFBGA surface-mount package (15×15 UBGA) enables compact, high-density PCB designs.

Why Choose 10M08SAU324I7G?

The 10M08SAU324I7G combines a balanced logic capacity, significant on-chip RAM, and a high I/O count in a compact 324-LFBGA package, making it suitable for designs that require integrated logic and memory with robust I/O connectivity. Its industrial-grade temperature range and RoHS compliance support deployments where environmental resilience and regulatory compliance are required.

Because the device is part of the Intel MAX 10 family, comprehensive device documentation covering electrical characteristics, configuration, and timing is available to aid development and validation, providing clarity for engineering and procurement decisions.

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