10M08SAU169I7P

The 10M08SAU169I7P is an Intel MAX® 10 FPGA device delivering a mid-range, non-volatile FPGA fabric with on-chip memory and flexible I/O for industrial applications. It integrates 8,000 logic elements, 387,072 total RAM bits, and up to 130 I/O pins in a compact 169-ball LFBGA package.

Designed for use where configurable logic, embedded memory, and a broad operating temperature range are required, this device supports deployment across industrial systems that demand ruggedized temperature performance and a surface-mount package for compact PCB designs.

Key Features

• Logic Capacity  8,000 logic elements provide mid-range programmable logic density for combinational and sequential designs.
• Logic Array Blocks (LABs)  500 LABs (logic array blocks) for organized logic partitioning and resource allocation.
• On-Chip Memory  387,072 total RAM bits enable local buffering, FIFOs, and small embedded data stores without external memory.
• I/O Count  130 I/O pins support multiple external peripherals and parallel interfaces directly from the FPGA fabric.
• Power and Supply  Supports a supply voltage range of 2.85 V to 3.465 V for core and I/O domain flexibility within specified system rails.
• Package & Mounting  169-LFBGA (169-UBGA, 11×11) surface-mount package suitable for space-constrained PCB layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control  Programmable logic and 130 I/Os allow implementation of control logic, motor interfaces, and deterministic I/O handling in industrial systems operating across −40 °C to 100 °C.
• Embedded Processing  Use the 8,000 logic elements and on-chip RAM for embedded state machines, pre-processing, and protocol bridging within compact systems.
• Sensor and Data Aggregation  On-chip RAM and numerous I/Os support aggregation, buffering, and preprocessing of sensor data before handing off to host processors.
• Human–Machine Interfaces (HMI)  Drive and manage displays, keypads, and peripheral interfaces with dedicated I/O and programmable logic for custom UI control.

Unique Advantages

• Balanced Logic and Memory:  8,000 logic elements paired with 387,072 RAM bits let you partition functions between logic and on-chip storage without relying on external memory for many applications.
• Generous I/O Density:  130 I/Os provide flexible connectivity to sensors, actuators, displays, and communication peripherals, reducing the need for additional interface chips.
• Industrial-Grade Temperature Range:  Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Compact Surface-Mount Packaging:  169-LFBGA (11×11 UBGA) delivers a small PCB footprint for space-constrained designs while maintaining routing density.
• Wide Supply Voltage Support:  Operates across a 2.85 V to 3.465 V supply range to accommodate common system rails.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious designs and regulatory compliance.

Why Choose 10M08SAU169I7P?

The 10M08SAU169I7P positions itself as a compact, industrial-grade FPGA option that combines moderate logic density, substantive on-chip RAM, and a high I/O count in a surface-mount LFBGA package. Its specified operating range and RoHS compliance make it suitable for designs that require reliable programmable logic in temperature-demanding environments.

This device is well suited to engineers and procurement teams seeking a configurable hardware building block for industrial control, embedded processing, and peripheral aggregation where on-chip memory and flexible I/O reduce external component count and simplify board-level design.

Request a quote or submit an inquiry to get pricing and availability for the 10M08SAU169I7P and begin integrating this Intel MAX® 10 FPGA into your next industrial design.