10M08SAM153I7G

The 10M08SAM153I7G is an Intel MAX® 10 FPGA in a 153-ball VFBGA package that integrates programmable logic, on-chip memory, and a broad I/O count for embedded and industrial designs. With 8,000 logic elements and 387,072 total RAM bits, this device targets use cases that require moderate logic density, significant on-chip RAM, and up to 112 I/O pins within a surface-mount BGA footprint.

Designed and supplied by Intel, the device operates over a wide industrial temperature range and supports single-supply voltage operation, making it suitable for designs that must meet defined temperature and supply constraints while leveraging the MAX 10 device family architecture.

Key Features

• Logic Capacity: 8,000 logic elements for implementing custom digital functions and state machines.
• On-chip RAM: 387,072 total RAM bits to support data buffering, FIFOs, and small embedded memories without external SRAM.
• I/O Density: 112 user I/O pins to interface with sensors, peripherals, and external devices.
• Power Supply Range: Operates from 2.85 V to 3.465 V, enabling designs that require this specific supply envelope.
• Package & Mounting: 153-VFBGA package (supplier device package listed as 153-MBGA, 8×8); surface-mount mounting for compact PCB implementations.
• Temperature Rating: Industrial-grade operation from −40 °C to 100 °C for temperature-demanding environments.
• RoHS Compliant: Meets RoHS environmental requirements for restricted substances.
• Intel MAX 10 Family: Part of the Intel MAX 10 device family as described in the Intel MAX 10 FPGA device datasheet.

Unique Advantages

• Balanced Logic and Memory: 8,000 logic elements combined with 387,072 RAM bits provides a practical balance for mid-density programmable designs without immediate need for external memory.
• Generous I/O Count: 112 I/O pins allow direct interfacing to multiple peripherals and parallel interfaces, reducing external I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in temperature-sensitive or outdoor equipment.
• Compact BGA Footprint: 153-ball VFBGA (supplier package 153-MBGA 8×8) keeps board area low while enabling a high pin count for dense designs.
• Single-Supply Flexibility: Operates within a 2.85 V to 3.465 V supply window to match system power rails and simplify power budgeting.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for modern electronics production.

Why Choose 10M08SAM153I7G?

The 10M08SAM153I7G offers a balanced combination of programmable logic, on-chip RAM, and I/O capacity in a compact surface-mount BGA package, positioned for designs that require mid-range logic density with substantial internal memory. Its industrial temperature rating and defined supply range make it suitable for applications that must operate reliably across a wide thermal and power envelope.

For engineers and procurement teams seeking a MAX 10 family FPGA with 8,000 logic elements, 387,072 RAM bits, and 112 I/Os in a 153-ball package, the 10M08SAM153I7G provides verifiable specifications and RoHS compliance to support product development and production planning.

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