10M08SAE144I7G

The 10M08SAE144I7G is an Intel MAX® 10 FPGA delivering 8,000 logic elements in a 144-pin LQFP exposed-pad package. It integrates on-chip RAM, a broad I/O count, and an industrial-grade operating range for embedded and control-oriented applications.

Designed as part of the Intel MAX 10 device family, this device targets designs that require moderate logic density, substantial on-chip RAM, and up to 101 user I/O signals, while operating from a 2.85 V to 3.465 V supply range.

Key Features

• Logic Capacity  8,000 logic elements provide mid-range programmable logic resources for glue logic, protocol bridging, and control functions.
• On-chip Memory  387,072 total RAM bits to support buffering, data path storage, and small on-chip data structures without external memory.
• I/O Density  101 user I/O pins to interface with sensors, peripherals, and external controllers.
• Power Supply  Operates from a 2.85 V to 3.465 V supply range to match common system power rails.
• Package and Mounting  144-LQFP with exposed pad (supplier package listed as 144-EQFP, 20×20); surface-mount package suitable for compact PCB layouts and thermal via connection.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
• Regulatory  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Industrial Control  Gate-level control, I/O aggregation, and deterministic logic functions using industrial temperature rating (−40 °C to 100 °C) and up to 101 I/O.
• Embedded Interfaces  Interface bridging and protocol adaptation where on-chip RAM (387,072 bits) and mid-range logic (8,000 logic elements) reduce the need for external components.
• Human–Machine Interfaces (HMI)  Control and signal conditioning for displays, buttons, and sensors leveraging available I/O and local memory for buffering.

Unique Advantages

• Balanced Logic and Memory  Combines 8,000 logic elements with 387,072 RAM bits to support integrated data-paths and control logic without immediate reliance on external memory.
• High I/O Count  101 user I/O pins enable direct connectivity to multiple peripherals, simplifying PCB routing and reducing component count.
• Industrial Temperature Capability  −40 °C to 100 °C rating allows deployment in a wide range of field and factory environments.
• Exposed-pad Package for Thermal Management  144-LQFP exposed pad provides a path for heat dissipation in surface-mount assemblies.
• Flexible Power Range  2.85 V to 3.465 V supply range matches common system rails for easier integration.
• RoHS Compliance  Meets lead-free manufacturing requirements for modern electronics production.

Why Choose 10M08SAE144I7G?

As a member of the Intel MAX 10 FPGA family, the 10M08SAE144I7G offers a practical balance of programmable logic, on-chip RAM, and I/O density for embedded and industrial designs. Its industrial temperature rating and exposed-pad 144-LQFP package make it suitable for applications where thermal management and extended operating temperatures are important.

Choose this device when your design requires a mid-density FPGA with substantial internal memory and a broad I/O complement, while maintaining surface-mount packaging and RoHS compliance.

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