10M08SAE144I7P

The 10M08SAE144I7P is a MAX® 10 field programmable gate array (FPGA) in a 144-LQFP exposed pad surface-mount package, designed for industrial-grade applications. It provides a balanced combination of logic capacity, embedded RAM, and a generous I/O count for systems that require flexible digital integration within a compact package.

With 8,000 logic elements, 387,072 total RAM bits and support for 101 I/Os, this device targets embedded and industrial control applications that need moderate FPGA resources, robust I/O connectivity, and extended operating conditions.

Key Features

• Core Logic  8,000 logic elements to implement custom digital logic, state machines, and glue logic within a single FPGA device.
• On‑Chip Memory  387,072 total RAM bits provide embedded storage for buffers, FIFOs, and small data structures.
• I/O Density  101 general-purpose I/Os to connect to sensors, actuators, interfaces, and peripheral devices.
• Power Supply  Operates from a 2.85 V to 3.465 V supply range to match common system rails.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C for use in extended-temperature environments.
• Package and Mounting  144-LQFP exposed pad (supplier package: 144‑EQFP, 20×20) in a surface-mount form factor for PCB designs requiring thermal performance and a compact footprint.
• Grade and Compliance  Industrial grade device and RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Control Systems  Implements control logic, custom interfaces, and signal aggregation where extended temperature operation (–40 °C to 100 °C) is required.
• Embedded Processing and Glue Logic  Provides programmable logic and routing for custom data paths and peripheral adaptation using 8,000 logic elements and abundant I/Os.
• Sensor and Actuator Interfaces  101 I/Os allow direct connection to multiple sensors and actuators for monitoring, preprocessing, and timing-critical functions.
• Instrumentation and Test Equipment  On-chip RAM and flexible I/O support buffering, data capture, and custom protocol handling in compact, surface-mount designs.

Unique Advantages

• Balanced Logic Capacity: 8,000 logic elements give designers room to implement moderate-complexity FPGA functions without oversizing the device.
• Substantial Embedded RAM: 387,072 total RAM bits enable local buffering and small data storage without external memory.
• High I/O Count: 101 I/Os provide flexibility for multi-sensor systems, parallel interfaces, and mixed-signal peripheral connectivity.
• Industrial Reliability: –40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environmental conditions.
• Surface-Mount Exposed-Pad Package: The 144‑LQFP exposed pad (144‑EQFP, 20×20) offers a compact footprint with thermal management options for board-level integration.
• RoHS Compliant: Designed to meet environmental compliance requirements for modern electronic assemblies.

Why Choose 10M08SAE144I7P?

The 10M08SAE144I7P positions itself as a practical FPGA choice for engineers who need a moderate logic resource, significant on-chip RAM, and a high number of I/Os in an industrial-temperature, surface-mount package. Its 8,000 logic elements and 387,072 RAM bits provide a useful balance between capability and board-level cost and complexity.

Choose this device for embedded and industrial designs that require reliable operation from –40 °C to 100 °C, flexible connectivity through 101 I/Os, and a compact 144‑LQFP exposed pad package that simplifies thermal and PCB integration.

Request a quote or submit an inquiry to receive pricing and availability for the 10M08SAE144I7P and to discuss how it can fit your design requirements.