10M08SAM153C8G

IC FPGA 112 I/O 153MBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 112 387072 8000 153-VFBGA

Quantity 788 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package153-MBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case153-VFBGANumber of I/O112Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs500Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits387072

Overview of 10M08SAM153C8G – MAX® 10 FPGA, 8,000 Logic Elements, 112 I/O

The 10M08SAM153C8G is a MAX® 10 Field Programmable Gate Array (FPGA) offered in a 153-VFBGA package for surface-mount assembly. It provides a mid-range programmable logic resource set suitable for commercial embedded designs that require on-chip RAM and a flexible I/O count.

Designed for applications that need configurable digital logic, the device combines 8,000 logic elements with 387,072 bits of on-chip RAM and 112 I/O pins, delivering a balanced mix of logic, memory, and connectivity in a single-chip solution.

Key Features

  • Logic  8,000 logic elements to implement combinational and sequential logic functions for custom digital designs.
  • Memory  387,072 total RAM bits of on-chip memory to support data buffering, FIFOs, and small lookup tables without external memory.
  • I/O  112 I/O pins, enabling multiple peripheral interfaces and board-level signal routing flexibility.
  • Power Supply  Supports core/IO operation across a supply range of 2.85 V to 3.465 V to match common system voltage rails.
  • Package & Mounting  153-VFBGA (supplier package: 153-MBGA, 8×8) in a surface-mount form factor for compact board designs.
  • Operating Conditions  Commercial-grade part with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded system logic  Use the FPGA to implement custom control logic, glue logic, and finite-state machines where integrated programmable resources reduce board complexity.
  • On-chip buffering and data handling  Leverage 387,072 bits of RAM for temporary storage, FIFOs, and small data processing tasks without external memory.
  • Multi-interface boards  Deploy the 112 I/O pins to bridge and manage multiple digital interfaces and peripherals on compact PCBs.

Unique Advantages

  • Balanced logic and memory: 8,000 logic elements combined with substantial on-chip RAM allow many designs to remain self-contained, reducing external BOM costs.
  • Generous I/O count: 112 I/Os provide flexibility for connecting sensors, peripherals, and system buses without immediate need for I/O expanders.
  • Compact surface-mount package: The 153-VFBGA (153-MBGA 8×8) enables dense PCB layouts and space-efficient designs.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial electronics applications.
  • RoHS compliant: Conforms to environmental requirements for lead-free assembly and global product compliance.

Why Choose 10M08SAM153C8G?

The 10M08SAM153C8G positions itself as a practical, commercially graded FPGA option for designers who need a mid-range combination of programmable logic, embedded RAM, and flexible I/O in a compact surface-mount package. Its 8,000 logic elements and 387,072 RAM bits make it suitable for embedded control, interface consolidation, and on-board data buffering tasks.

For engineering teams focused on reducing board complexity and keeping parts count low, this MAX® 10 device offers a verifiable mix of resources, a clear supply voltage window, and RoHS compliance—providing predictable integration for commercial product lines.

Request a quote or submit your procurement inquiry to evaluate the 10M08SAM153C8G for your next design project.

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