10M08SAU169A7G

The 10M08SAU169A7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 169‑LFBGA package. It delivers a balanced mix of logic, embedded RAM, and I/O density for designs that require reconfigurable hardware in automotive-qualified hardware.

With 8,000 logic elements, 387,072 bits of on-chip RAM and up to 130 general-purpose I/Os, this device targets automotive and embedded applications that need programmable logic, wide operating temperature range, and AEC‑Q100 qualification.

Key Features

• Logic Capacity — 8,000 logic elements suitable for mid-density programmable logic implementations.
• Embedded RAM — 387,072 total RAM bits for on-chip data buffering, state storage, and small memory structures.
• I/O Density — Up to 130 I/O pins to interface with sensors, actuators, buses, and serial/peripheral devices.
• Package & Mounting — 169‑LFBGA (supplier package: 169‑UBGA, 11×11) in a surface-mount form factor for compact board designs.
• Power Supply Range — Operates from 2.85 V to 3.465 V, providing flexibility in system power architectures.
• Automotive Qualification — Automotive grade with AEC‑Q100 qualification for use in applications requiring that certification.
• Temperature Range — Specified operating range from −40 °C to 125 °C for extended-temperature environments.
• Regulatory Compliance — RoHS‑compliant device for environmental and manufacturing compliance.

Typical Applications

• Automotive control modules — AEC‑Q100 qualification and −40 °C to 125 °C rating make it suitable for in-vehicle control and embedded logic functions that require configurability and resilience to temperature extremes.
• Sensor aggregation and preprocessing — Up to 130 I/Os and significant on‑chip RAM provide capacity for collecting and buffering sensor data at the edge of the system.
• Embedded logic and interface bridging — 8,000 logic elements enable mid-density hardware acceleration, protocol bridging, and custom peripheral glue logic within compact packages.

Unique Advantages

• AEC‑Q100 qualified — Built for automotive-grade deployments where qualification is required, reducing additional component qualification work.
• Balanced resource mix — A combination of 8,000 logic elements and 387,072 RAM bits supports both control logic and local data storage without external memory.
• High I/O count — 130 I/Os simplify integration with multiple sensors, actuators, and peripheral interfaces without complex multiplexing.
• Wide operating temperature — −40 °C to 125 °C rating supports harsh-environment installations and broad deployment scenarios.
• Compact surface-mount package — 169‑LFBGA (11×11 UBGA) reduces PCB footprint while providing robust connectivity for board-level integration.
• Regulatory readiness — RoHS compliance eases environmental compliance for manufactured products.

Why Choose 10M08SAU169A7G?

The 10M08SAU169A7G combines mid-range programmable logic capacity with substantial on-chip RAM and a high I/O count in a compact LFBGA package. Its AEC‑Q100 qualification and extended temperature rating make it a practical choice for automotive and demanding embedded systems that require configurable hardware implemented reliably across temperature extremes.

This device suits engineers and procurement teams designing scalable, reconfigurable subsystems where integrated RAM, ample I/O, and automotive qualification reduce system complexity and qualification overhead. Its specifications support robust, space-efficient implementations while preserving the flexibility of FPGA-based design.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the 10M08SAU169A7G.