10M08SAU169I7G

The 10M08SAU169I7G is an Intel MAX® 10 FPGA in a 169-LFBGA (169-UBGA, 11×11) package. It provides on-chip programmable logic, embedded RAM, and a generous set of I/O in an industrial-grade surface-mount device.

Designed for embedded and system-level FPGA implementations, this device targets applications where moderate logic density, integrated RAM, and industrial operating range are required. Key value is delivered through integrated resources and a compact package footprint.

Key Features

• Logic Capacity — 8,000 logic elements for implementing glue logic, state machines, and custom hardware functions.
• Embedded Memory — 387,072 total RAM bits to support buffering, FIFOs, and on-chip data storage without external memory.
• I/O Resources — 130 I/O pins to interface with sensors, peripherals, and external devices directly from the FPGA.
• Package — 169-LFBGA (169-UBGA, 11×11) surface-mount package that balances I/O count and board-area efficiency.
• Power Supply — Operates from 2.85 V to 3.465 V supply range to match common system power rails.
• Industrial Temperature Range — Rated for −40°C to 100°C operation for deployment in industrial environments.
• Mounting and Compliance — Surface-mount device with RoHS compliance for standard manufacturing and environmental requirements.
• Device Grade and Speed Options — Part of the MAX® 10 family with industrial grading and supported speed grades noted in the device datasheet.

Typical Applications

• Industrial Automation — Implement control logic, I/O consolidation, and deterministic state machines within industrial equipment operating across a wide temperature range.
• Embedded System Integration — Provide glue logic, protocol adaptation, and custom peripherals where moderate logic density and on-chip RAM simplify board design.
• Interface Bridging — Aggregate and translate signals between multiple peripherals and system buses using the device’s ample I/O resources.
• Prototyping and Development — Use as a compact FPGA platform for validating hardware logic and embedded architectures prior to production.

Unique Advantages

• Balanced Logic and Memory: 8,000 logic elements paired with 387,072 RAM bits enable a wide range of mid-density designs without immediate need for external memory.
• High I/O Count in Compact Package: 130 I/O in a 169-LFBGA (11×11) package provides system designers flexibility while preserving PCB area.
• Industrial Reliability: Specified for −40°C to 100°C operation, supporting deployments in harsher industrial temperature conditions.
• Flexible Power Range: 2.85 V to 3.465 V supply compatibility simplifies integration with common system power rails.
• RoHS Compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose 10M08SAU169I7G?

The 10M08SAU169I7G delivers a balanced combination of logic density, embedded RAM, and I/O resources in an industrial-grade MAX® 10 FPGA package. Its compact 169-LFBGA footprint and broad operating temperature range make it suitable for system-level integration where board space and environmental robustness matter.

This device is appropriate for engineers specifying mid-density programmable logic in industrial and embedded applications who need integrated memory and a high I/O count without moving to larger packages or external components. Backed by the MAX® 10 family datasheet specifications, it provides a verifiable platform for long-term designs and production planning.

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