10M08SAU324C8G

The 10M08SAU324C8G is a MAX® 10 field programmable gate array (FPGA) from Intel, offered in a 324-LFBGA package. It provides a mid-range logic capacity with integrated on-chip RAM and a high count of I/O for commercial embedded designs.

Designed for commercial-grade applications, this surface-mount FPGA delivers 8,000 logic elements, 387,072 total RAM bits, and 246 I/Os while operating from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C temperature range.

Key Features

• Core & Logic 8,000 logic elements provide balanced logic capacity for custom combinational and sequential designs.
• Memory 387,072 total RAM bits for on-chip data buffering, state storage, and small lookup tables.
• I/O 246 I/Os enable broad connectivity for peripherals, sensors, and external interfaces.
• Power Operates from a 1.15 V to 1.25 V supply range to match system power rails and design requirements.
• Package & Mounting 324-LFBGA package, supplier device package 324-UBGA (15×15), in a surface-mount form factor suitable for compact PCB layouts.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial-environment deployments.
• Environmental Compliance RoHS compliant for conformity with common electronic materials regulations.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, state machines, and peripheral interfacing in consumer or business equipment.
• Prototyping and Development — Deploy for hardware validation and iterative FPGA designs requiring reprogrammable logic and on-chip RAM.
• I/O-Intensive Interfaces — Aggregate and manage multiple external signals using the 246 available I/Os for complex connectivity tasks.
• Data Buffering and Local Processing — Use the integrated RAM for temporary storage, small FIFOs, and look-up operations close to logic functions.

Unique Advantages

• Balanced Logic Density: 8,000 logic elements offer sufficient capacity for mid-range custom logic without excessive die size.
• Substantial On-Chip RAM: 387,072 RAM bits reduce dependence on external memory for many buffering and state-storage needs.
• High I/O Count: 246 I/Os simplify board-level design by enabling direct connections to numerous peripherals and interfaces.
• Compact SMT Packaging: 324-LFBGA (324-UBGA, 15×15) supports compact PCB layouts while maintaining robust pin count.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching typical commercial application environments.
• Regulatory Compliance: RoHS compliance supports material and environmental requirements for many product lines.

Why Choose 10M08SAU324C8G?

The 10M08SAU324C8G positions itself as a practical, mid-range FPGA option within the MAX® 10 family, combining 8,000 logic elements, substantial on-chip memory, and a high I/O count in a compact 324-LFBGA surface-mount package. Its commercial-grade temperature rating and RoHS compliance make it suitable for a wide range of commercial embedded applications that require flexible, reprogrammable logic and local data storage.

Engineers and procurement teams seeking a balanced solution for prototyping, control logic, and I/O-rich designs will find this part offers a clear trade-off of capability and footprint, backed by the MAX® 10 product lineage.

Request a quote or submit an inquiry to receive pricing, availability, and delivery information for the 10M08SAU324C8G.