10M08SAU169C8G

The 10M08SAU169C8G is a commercial‑grade Intel MAX® 10 FPGA in a 169‑LFBGA package that combines programmable logic, on‑chip RAM, and plentiful I/O for space‑efficient, board‑level integration. With 8,000 logic elements, 387,072 bits of on‑chip RAM and 130 I/Os, it targets designers who need moderate density FPGA capability in a compact surface‑mount package.

Designed for 3.3 V system domains (2.85 V to 3.465 V supply range) and rated for operation from 0 °C to 85 °C, this device is suited to a range of commercial embedded applications requiring configurable logic, memory and flexible interfacing.

Key Features

• Logic Capacity — 8,000 logic elements and 500 CLBs provide a balanced fabric for implementing combinational and sequential logic, control state machines, and glue logic.
• On‑Chip Memory — 387,072 total RAM bits available for FIFOs, buffers, small data tables and local storage to reduce external memory needs.
• I/O Density — 130 I/O pins to support multiple parallel interfaces, sensor connections, and peripheral signaling on a single device.
• Power and Supply — Supports a voltage supply range of 2.85 V to 3.465 V suitable for standard 3.3 V systems.
• Package and Mounting — 169‑LFBGA (supplier package: 169‑UBGA 11×11) in a surface‑mount form factor for compact PCB footprint and reliable board assembly.
• Commercial Temperature Grade — Operating temperature range of 0 °C to 85 °C for commercial applications.
• Environmental Compliance — RoHS‑compliant to meet common environmental requirements for commercial electronics.

Typical Applications

• Embedded Control and Interface Logic — Use the device’s 8,000 logic elements and 130 I/Os to implement control functions, protocol bridging and peripheral interfacing in compact systems.
• Human‑Machine Interfaces — On‑chip RAM and ample I/O enable responsive display control, input handling and local buffering for commercial user interfaces.
• Prototyping and Development — Compact LFBGA package and surface‑mount mounting make this FPGA suitable for board‑level prototyping of commercial electronic products.
• Data Buffering and Signal Conditioning — Use internal RAM for temporary data storage and logic resources for signal processing or conditioning tasks within commercial equipment.

Unique Advantages

• Integrated Memory and Logic: 387,072 bits of on‑chip RAM paired with 8,000 logic elements reduce dependence on external memory and simplify BOM.
• High I/O Count in a Compact Package: 130 I/Os in a 169‑LFBGA footprint enable multiple interfaces without a larger board area.
• Commercial‑Grade Operating Range: Rated for 0 °C to 85 °C operation to meet typical commercial product requirements.
• Standard 3.3 V System Compatibility: Supply range of 2.85 V to 3.465 V aligns with common 3.3 V logic domains for straightforward integration.
• RoHS Compliant: Meets environmental compliance expectations for commercial electronics manufacturing.

Why Choose 10M08SAU169C8G?

The 10M08SAU169C8G combines a useful balance of logic capacity, on‑chip RAM and I/O density in a compact 169‑LFBGA surface‑mount package, making it well suited for commercial embedded designs where board space and integration matter. Its supply voltage range and commercial temperature rating allow straightforward incorporation into standard 3.3 V systems.

This device is appropriate for designers building control logic, interface bridges, local buffering and similar functions who need a reliable, RoHS‑compliant FPGA solution with clear, verifiable specifications for logic elements, memory, I/O count, package and operating conditions.

Request a quote or submit a pricing inquiry to check availability and lead times for the 10M08SAU169C8G.