10M08SCE144C7G

The 10M08SCE144C7G is an Intel MAX® 10 field programmable gate array (FPGA) provided in a 144-LQFP exposed pad package for surface-mount applications. It delivers a defined combination of programmable logic, on-chip RAM, and general-purpose I/O suitable for commercial embedded designs.

With 8,000 logic elements, 387,072 bits of on-chip RAM and 101 I/O pins, this device targets commercial applications that require moderate logic capacity, on-chip memory, and flexible I/O in a compact 20 × 20 mm package. The device operates from 2.85 V to 3.465 V and is specified for 0 °C to 85 °C operation.

Key Features

• Logic Capacity — 8,000 logic elements provide predictable programmable logic resources for custom control, glue-logic, and mid-complexity designs.
• On-chip Memory — 387,072 total RAM bits support data buffering, small FIFOs, and local storage without external memory.
• I/O Count — 101 general-purpose I/O pins enable broad peripheral interfacing and signal routing in constrained PCB layouts.
• Packaging & Mounting — 144-LQFP exposed pad package (supplier package listed as 144-EQFP, 20 × 20 mm) for surface-mount assembly and thermal pad support.
• Power Supply Range — Operates from 2.85 V to 3.465 V to match common system rails.
• Commercial Grade — Specified for 0 °C to 85 °C operating temperature and the commercial speed grade suffix -C7.
• Standards Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Use the 8,000 logic elements and on-chip RAM for custom finite-state machines, peripheral supervision, and control logic in commercial products.
• Interface Bridging — 101 I/O pins support protocol conversion and signal aggregation between multiple digital peripherals or subsystems.
• Prototyping and Development — Compact package and moderate resource set make the device suitable for iterative design and validation of mid-complexity FPGA functions within commercial temperature limits.

Unique Advantages

• Balanced Logic and Memory — The combination of 8,000 logic elements and 387,072 RAM bits lets designers implement both control logic and local data storage on-chip, reducing external components.
• High I/O Density in a Compact Package — 101 I/Os in a 144-LQFP footprint enable rich connectivity without a large PCB area impact.
• Surface-Mount Exposed Pad — The exposed pad in the 144-LQFP package supports thermal management and reliable surface-mount assembly.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation, aligning with many commercial product requirements.
• RoHS Compliant — Meeting environmental compliance expectations for commercial electronics production.

Why Choose 10M08SCE144C7G?

The 10M08SCE144C7G provides a focused FPGA option for commercial designs that need moderate programmable logic, substantial on-chip RAM, and a large number of general-purpose I/Os in a compact surface-mount package. Its defined voltage range, commercial temperature rating, and RoHS compliance make it straightforward to integrate into production electronics where these specific, verifiable characteristics are required.

This device is well suited to engineers and procurement teams seeking a predictable, mid-density FPGA building block for interface logic, control functions, and prototyping in commercial applications, delivering on-chip memory and I/O density to simplify board-level designs.

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