10M08SCM153I7G

The 10M08SCM153I7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 153‑VFBGA package. It provides 8,000 logic elements and 387,072 bits of embedded RAM with 112 general-purpose I/O pins, packaged as a surface-mount 153‑MBGA (8×8) footprint.

Designed and graded for industrial operation, this device supports a 2.85 V to 3.465 V supply range and an operating temperature span of −40 °C to 100 °C, making it suitable for embedded designs that require moderate logic density, significant on‑chip RAM, and robust temperature performance.

Key Features

• Core Logic  8,000 logic elements provide programmable fabric for custom logic, state machines, and moderate-density FPGA designs.
• On‑Chip Memory  387,072 bits of total RAM for buffering, packet storage, and local data processing without external memory.
• I/O Resources  112 I/O pins to support multiple peripherals, sensor interfaces, and I/O aggregation in a compact package.
• Power  Operates from a 2.85 V to 3.465 V supply window, enabling compatibility with a range of 3 V systems.
• Package & Mounting  153‑VFBGA (supplier package: 153‑MBGA, 8×8) in a surface‑mount form factor suitable for compact PCB implementations.
• Temperature & Grade  Industrial grade with an operating temperature of −40 °C to 100 °C for deployment in extended temperature environments.
• Compliance  RoHS‑compliant construction for environmental and regulatory adherence.

Typical Applications

• Industrial Control Systems  Industrial temperature rating and 112 I/O make this FPGA suitable for control logic, I/O aggregation, and peripheral interfacing in factory or process equipment.
• Embedded Processing  8,000 logic elements and substantial on‑chip RAM support custom data paths, protocol handling, and lightweight processing tasks within embedded products.
• Communications and I/O Bridging  High I/O count and embedded memory enable buffering and protocol translation between multiple interfaces in compact designs.
• Compact, Surface‑Mount Systems  The 153‑VFBGA surface‑mount package fits space‑constrained PCBs where a soldered BGA footprint is required.

Unique Advantages

• Industrial‑grade reliability: Rated for −40 °C to 100 °C operation, supporting deployment in harsh or temperature‑variable environments.
• Balanced logic and memory: 8,000 logic elements combined with 387,072 bits of RAM deliver on‑chip resources for control, buffering, and deterministic data handling without immediate need for external memory.
• High I/O density: 112 I/O pins provide flexibility for multi‑device interfacing, sensor networks, and peripheral consolidation, reducing system complexity.
• Compact BGA packaging: 153‑VFBGA (153‑MBGA, 8×8) minimizes PCB area while enabling surface‑mount assembly for modern manufacturing processes.
• Wide supply compatibility: 2.85 V to 3.465 V supply range allows integration into a variety of 3 V systems and power architectures.
• RoHS compliance: Meets RoHS requirements for lead‑free, environmentally conscious designs.

Why Choose 10M08SCM153I7G?

The 10M08SCM153I7G combines a MAX® 10 FPGA architecture with a compact BGA package and industrial temperature capability to deliver a versatile solution for embedded and industrial applications. Its mix of 8,000 logic elements, substantial on‑chip RAM, and 112 I/O pins provides a balanced platform for designers who need programmable logic, local memory, and flexible interfacing in a surface‑mount, RoHS‑compliant device.

This part is well suited to engineers and teams developing control, interface, or mid‑density logic solutions that require robustness across temperature and a compact board footprint, while leveraging Intel’s MAX 10 device family characteristics.

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