10M08SCU169A7G

The 10M08SCU169A7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 169-LFBGA (169-UBGA, 11×11) surface-mount package. This automotive-grade device is qualified to AEC-Q100 and combines a mid-range logic capacity with on-chip RAM and a substantial I/O count for board-level embedded designs that require qualified components and extended temperature operation.

Key attributes include 8,000 logic elements, 387,072 bits of total RAM, 130 I/O pins, a supply voltage range of 2.85 V to 3.465 V, and an operating temperature range of −40 °C to 125 °C—features that support integration of control, interface, and buffering functions in space-constrained systems.

Key Features

• Logic Capacity  Provides 8,000 logic elements suitable for mid-density programmable logic tasks and custom control logic implementations.
• On‑chip Memory  Contains 387,072 bits of total RAM to support buffering, state machines, and local data storage without external memory.
• I/O Resources  130 general-purpose I/O pins for flexible interfacing to sensors, actuators, buses, and peripherals on the board.
• Package and Mounting  169-LFBGA (169-UBGA, 11×11) surface-mount package for compact, high-density PCB integration.
• Supply Voltage  Operates from 2.85 V to 3.465 V to match common system power rails.
• Extended Temperature Range  Rated for −40 °C to 125 °C operation, enabling use in thermally demanding environments.
• Automotive Qualification  AEC‑Q100 qualification and explicit automotive grading for designs that require automotive-level component qualification.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Automotive electronic control modules  AEC‑Q100 qualification and −40 °C to 125 °C operating range support use in vehicle electronics requiring qualified components.
• Board‑level programmable logic  Compact 169‑LFBGA package with 130 I/O makes the device suitable for dense PCB designs that need configurable logic and interfaces.
• On‑chip buffering and local memory tasks  387,072 bits of RAM and 8,000 logic elements provide capacity for local data handling, state machines, and intermediate buffering.

Unique Advantages

• Qualified for automotive use: AEC‑Q100 qualification and automotive grade reduce qualification burden when integrating into vehicle systems.
• Balanced logic and memory: The combination of 8,000 logic elements with 387,072 bits of RAM supports mixed control and data buffering requirements without immediate need for external SRAM.
• High I/O count in a compact footprint: 130 I/O in a 169‑LFBGA (11×11) package enables rich connectivity while minimizing board area.
• Wide operating temperature and supply windows: −40 °C to 125 °C operation and 2.85 V–3.465 V supply compatibility simplify integration into automotive and harsh-environment power architectures.
• Surface-mount package for modern assembly: 169‑UBGA surface-mount packaging supports automated PCB assembly processes for production-scale builds.
• RoHS compliance: Meets environmental requirements for lead‑free assembly and regulatory compliance.

Why Choose 10M08SCU169A7G?

The 10M08SCU169A7G positions itself as a mid-density, automotive-qualified FPGA option within the Intel MAX® 10 family. Its combination of 8,000 logic elements, substantial on-chip RAM, and 130 I/O in a compact 169‑LFBGA package addresses designs that require configurable logic, on-board memory, and robust environmental performance.

This device is suited to engineers and procurement teams building vehicle electronics and other temperature-challenging applications who need a qualified, programmable logic component that balances integration, I/O density, and on-chip memory capacity while conforming to RoHS and AEC‑Q100 requirements.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the 10M08SCU169A7G.