10M08SCU324I7G

The 10M08SCU324I7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 324-ball LFBGA package. It provides reprogrammable digital logic with 8,000 logic elements and on-chip RAM totaling 387,072 bits, making it suitable for embedded and industrial designs that require flexible, board-level programmable logic.

Designed and specified for industrial operation, this 10M08 device supports a -I7 speed grade and delivers a balance of logic capacity, on-chip memory, and high pin-count I/O for applications that need moderate logic density and extensive external connectivity.

Key Features

• Core Logic  8,000 logic elements provide the programmable fabric for custom logic, state machines, and control functions.
• Logic Array Blocks  500 logic array blocks (LABs) for organized placement of logic resources and predictable partitioning.
• On-chip Memory  387,072 total RAM bits to support buffering, FIFOs, and small embedded data stores without external memory.
• I/O Capacity  246 general-purpose I/O pins for broad interfacing to sensors, buses, and peripherals.
• Power Supply  Core voltage support from 1.15 V to 1.25 V to match system power budgets and regulator designs.
• Package & Mounting  324-LFBGA package (supplier device package: 324-UBGA, 15×15) in a surface-mount form factor for compact board designs.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS-compliant construction for regulatory and environmental conformity.

Typical Applications

• Industrial Control  Use the 10M08SCU324I7G to implement deterministic control logic and I/O aggregation where the −40 °C to 100 °C rating and 246 I/O pins support robust sensor and actuator interfacing.
• Embedded System Customization  Implement custom glue logic, protocol bridging, or preprocessing functions using 8,000 logic elements and on-chip RAM to reduce external components.
• High‑Pin‑Count I/O Expansion  Leverage the 246 I/O pins in systems that require dense peripheral connections or multiple parallel interfaces while keeping the design compact with the 324-LFBGA package.

Unique Advantages

• Balanced logic and memory:  8,000 logic elements paired with 387,072 RAM bits allow meaningful on‑chip implementation of stateful logic and buffering without immediate need for external memory.
• High I/O density:  246 I/O pins provide flexibility for complex interfacing, reducing the need for external I/O expanders.
• Industrial temperature capability:  Rated from −40 °C to 100 °C to meet environmental requirements for many industrial applications.
• Compact surface-mount package:  The 324-LFBGA (324-UBGA, 15×15) footprint supports space-constrained PCBs while delivering substantial I/O and logic resources.
• Low-voltage core:  1.15 V to 1.25 V core supply allows integration into systems with modern low-voltage power rails.
• Regulatory compliance:  RoHS compliance simplifies end‑product regulatory planning.

Why Choose 10M08SCU324I7G?

The 10M08SCU324I7G positions itself as a versatile, industrial‑grade MAX® 10 FPGA option for designs that require moderate logic density, substantial on‑chip RAM, and high I/O count in a compact surface‑mount package. Its −40 °C to 100 °C operating range and -I7 speed grade make it appropriate for applications that demand reliable operation across a wide temperature span.

Engineers and procurement teams seeking a reprogrammable, RoHS-compliant FPGA with clear electrical and mechanical parameters will find this device suitable for embedded control, I/O consolidation, and system customization tasks where integration and predictable specs matter.

Request a quote or submit a product inquiry today to evaluate the 10M08SCU324I7G for your next design.