10M08SCE144A7G

The 10M08SCE144A7G is an Intel MAX® 10 field programmable gate array (FPGA) device in a 144‑LQFP exposed‑pad package. It combines logic fabric, on‑chip RAM, and flexible I/O in a surface‑mount package designed for embedded applications.

With 8,000 logic elements, 387,072 total RAM bits, 101 available I/O pins, AEC‑Q100 qualification and an extended operating temperature range, this device is suited to designs that require integrated logic and memory with automotive‑grade qualification and wide temperature tolerance.

Key Features

• Logic Capacity 8,000 logic elements for implementing combinational and sequential logic functions.
• On‑chip Memory 387,072 total RAM bits provide local storage for buffering, lookup tables, and data paths.
• I/O Resources 101 I/O pins enable diverse peripheral and bus interfacing directly from the FPGA package.
• Package 144‑LQFP exposed pad (supplier device package: 144‑EQFP 20×20) optimized for surface‑mount assembly and thermal conduction through the exposed pad.
• Power Supply Operates from a 2.85 V to 3.465 V supply range for compatibility with common system rails.
• Automotive Qualification AEC‑Q100 qualification and automotive grade designation for use in applications requiring that certification.
• Extended Temperature Range Rated for −40 °C to 125 °C operation to support harsh environments.
• RoHS Compliant Meets RoHS environmental requirements for lead‑free assembly.
• Mounting Type Surface mount device suitable for automated PCB assembly processes.

Typical Applications

• Automotive control systems AEC‑Q100 qualification and an extended −40 °C to 125 °C operating range make it appropriate for in‑vehicle control and signal processing functions.
• Industrial automation Wide temperature tolerance and robust package options support motor control, PLC interfacing, and factory automation subsystems.
• Embedded system integration On‑chip RAM and 8,000 logic elements allow integration of control logic, protocol handling, and glue logic in compact embedded designs.
• Sensor and interface aggregation 101 I/O pins provide connectivity for aggregating sensors, converters, and peripheral interfaces on a single device.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 certification supports deployment where automotive qualification is required.
• Balanced logic and memory: 8,000 logic elements combined with 387,072 RAM bits enables compact implementations of control, buffering, and state‑machine functions without external memories.
• Generous I/O count: 101 I/O pins simplify board‑level routing and reduce the need for external interface components.
• Wide supply compatibility: 2.85 V to 3.465 V supply range fits common system voltage rails for straightforward power integration.
• Exposed‑pad LQFP package: 144‑LQFP with exposed pad supports thermal management and is compatible with standard surface‑mount processes.
• Extended environmental tolerance: −40 °C to 125 °C operating range enables use in demanding thermal environments.

Why Choose 10M08SCE144A7G?

The 10M08SCE144A7G positions itself as a compact, automotive‑qualified MAX® 10 FPGA option that combines meaningful logic capacity, substantial on‑chip RAM, and a high I/O count in a standard 144‑LQFP exposed‑pad package. Its voltage and temperature ratings support integration into systems that require reliable operation across industry and automotive environments.

This part is well suited to engineers and procurement teams seeking a single‑chip solution to consolidate control logic, interface aggregation, and local buffering while maintaining AEC‑Q100 qualification and RoHS compliance for long‑term product deployment.

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