10M08SAE144C8G

The 10M08SAE144C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 144‑LQFP exposed‑pad surface‑mount package. It provides 8,000 logic elements, 387,072 bits of on‑chip RAM, and 101 general‑purpose I/Os for configurable digital logic and interface tasks.

Designed for commercial‑grade deployments, this device supports a 2.85 V to 3.465 V supply range and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of mid‑density programmable logic applications that require substantial I/O and embedded memory.

Key Features

• Logic Capacity  8,000 logic elements to implement medium‑complexity programmable logic functions and custom hardware blocks.
• Embedded Memory  387,072 total RAM bits for on‑chip storage of buffers, FIFOs, and small data structures without external memory.
• I/O Resources  101 I/Os to support dense peripheral interfacing and multiple external buses or sensors.
• Package and Mounting  144‑LQFP exposed pad (supplier package listed as 144‑EQFP 20×20) in a surface‑mount form factor for PCB integration and thermal conduction.
• Supply and Operating Range  Operates from 2.85 V to 3.465 V with a commercial temperature grade of 0 °C to 85 °C.
• Compliance and Documentation  RoHS‑compliant; detailed electrical, switching, and configuration specifications are available in the Intel MAX 10 device datasheet series.
• Device Grade and Speed  Commercial grade part; documented device grade and supported speed grades are included in the MAX 10 datasheet.

Typical Applications

• Interface and Glue Logic  Use the 101 I/Os and 8,000 logic elements to implement custom bus bridging, level translation logic, and protocol conversion between peripherals.
• Embedded Control  On‑chip RAM (387,072 bits) and programmable logic are suitable for control algorithms, state machines, and peripheral management in commercial products.
• Prototyping and Development  Medium‑density logic and abundant I/O make this FPGA suited to hardware prototyping and iterative design where reprogrammability is required.

Unique Advantages

• Balanced Logic and Memory  8,000 logic elements combined with 387,072 RAM bits provide a balanced resource mix for logic‑plus‑data applications without immediate reliance on external memory.
• I/O‑Rich Package  101 I/O pins in a compact 144‑LQFP package enable multiple external interfaces while maintaining a small PCB footprint.
• Commercial‑Grade Reliability  Specified operating temperature of 0 °C to 85 °C and RoHS compliance align the device with standard commercial product requirements.
• Surface‑Mount, Thermally Conducive Package  The exposed‑pad LQFP package supports surface‑mount assembly and thermal conduction for consistent board integration.
• Documented Intel MAX 10 Support  Datasheet coverage includes electrical characteristics, switching and timing, and configuration specifications to assist design and verification.

Why Choose 10M08SAE144C8G?

The 10M08SAE144C8G positions itself as a mid‑density, commercially rated MAX 10 FPGA that combines 8,000 logic elements, substantial on‑chip RAM, and a high I/O count in a compact surface‑mount package. Its documented electrical and configuration specifications make it practical for designs that need reprogrammable logic, moderate embedded memory, and broad peripheral connectivity.

This device is appropriate for design teams and procurement teams targeting commercial‑grade embedded systems, interface controllers, and prototype platforms where a verified Intel MAX 10 device and clear electrical specifications are required for system integration and production planning.

Request a quote or submit a procurement inquiry to begin sourcing the 10M08SAE144C8G for your next design.