10M08DFV81C8GES

The 10M08DFV81C8GES is an Intel MAX® 10 field‑programmable gate array (FPGA) in a compact 81‑UFBGA WLCSP package. It provides on‑chip reconfigurable digital logic and embedded memory in a surface‑mount package for space‑constrained board designs.

Key device characteristics include approximately 8,000 logic elements, 387,072 total RAM bits, 56 user I/O, a core supply voltage range of 1.15 V to 1.25 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied in an 81‑VBGA WLCSP (4.5 × 4.4 mm) footprint.

Key Features

• Logic Capacity  Approximately 8,000 logic elements for implementing custom digital logic and glue functions.
• Embedded Memory  387,072 total RAM bits of on‑chip memory to support buffers, FIFOs, and small data storage needs.
• I/O Resources  56 user I/O pins to interface with peripherals, sensors, and external devices.
• Power  Core voltage range of 1.15 V to 1.25 V to match system power rails and aid power planning.
• Package & Mounting  81‑UFBGA, WLCSP package (supplier package 81‑VBGA WLCSP, 4.5 × 4.4 mm) designed for surface‑mount assembly in compact designs.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Embedded controllers  Implement custom control logic and interface glue in compact embedded systems where on‑chip memory and a moderate number of I/Os are required.
• Protocol bridging  Create custom protocol converters or bus bridges using the device's logic resources and I/O count for interfacing between subsystems.
• Prototyping and development  Rapidly iterate digital designs and validate logic functions in a small, production‑aligned package.
• Consumer electronics  Integrate custom control and timing functions in space‑restricted consumer products using the WLCSP footprint.

Unique Advantages

• Compact package density  The 81‑UFBGA WLCSP (4.5 × 4.4 mm) package enables high functionality in a very small PCB area, reducing board footprint.
• Balanced logic and memory  A combination of ~8,000 logic elements and 387,072 RAM bits supports mixed logic and buffering needs without external memory for many use cases.
• Moderate I/O count  56 I/Os provide flexibility to connect sensors, peripherals, and interfaces while keeping pin count and routing manageable.
• Defined power envelope  A specified core supply range of 1.15 V to 1.25 V simplifies power supply design and integration into existing power architectures.
• Commercial temperature and compliance  Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product requirements.

Why Choose 10M08DFV81C8GES?

The 10M08DFV81C8GES delivers a practical balance of programmable logic, embedded memory, and I/O in a tiny WLCSP footprint. Its combination of ~8,000 logic elements, substantial on‑chip RAM, and 56 I/Os makes it well suited for compact board designs that require reconfigurable digital logic without large external components.

This commercial‑grade, RoHS‑compliant device is appropriate for customers seeking a compact, surface‑mount FPGA solution with clearly defined electrical and thermal ranges. It offers designers predictable supply requirements and package dimensions for efficient PCB layout and system integration.

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