10M08DFF484C7G

The 10M08DFF484C7G is an Intel MAX® 10 FPGA offered in a 484-ball fine-pitch BGA package. It combines on-chip logic, embedded RAM, and a high-density I/O matrix in a commercial-grade, surface-mount device.

This device provides 8,000 logic elements, 387,072 total RAM bits and up to 250 I/O pins, making it suitable for applications that require moderate logic capacity, substantial on-chip memory, and a large number of external interfaces. Electrical operation is supported over a 1.15 V to 1.25 V core supply range and an ambient temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  8,000 logic elements for implementing combinational and sequential logic.
• On‑chip Memory  387,072 total RAM bits to store buffers, FIFOs, or embedded data structures.
• I/O Density  Up to 250 I/O pins to support multiple external interfaces and parallel connections.
• Power Supply  Core voltage support from 1.15 V to 1.25 V for device operation.
• Package & Mounting  484-ball FBGA (23 × 23 mm) surface-mount package for compact board integration.
• Commercial Grade  Rated for operation from 0 °C to 85 °C for standard commercial-temperature designs.
• Regulatory  RoHS-compliant construction.

Typical Applications

• Logic‑intensive control systems  Implement control and glue‑logic functions using the device's 8,000 logic elements and abundant I/O.
• On‑board buffering and data handling  Use the 387,072 bits of on‑chip RAM for temporary storage, FIFOs, or packet buffering.
• Multi‑interface bridging  Leverage the 250 I/Os to connect multiple peripheral interfaces or parallel buses on a single FPGA.

Unique Advantages

• Balanced logic and memory  Combines 8,000 logic elements with substantial on‑chip RAM to support mixed logic and data buffering requirements without immediate reliance on external memory.
• High I/O count  Up to 250 I/Os enable flexible board-level connectivity and simplify interface routing.
• Compact BGA footprint  484-FBGA (23 × 23 mm) package provides a high pin count in a compact surface-mount form factor for dense PCB layouts.
• Commercial temperature rating  Specified for 0 °C to 85 °C operation for mainstream commercial designs.
• Low-voltage core operation  1.15 V to 1.25 V core supply range supports low-power core operation consistent with modern FPGA power domains.
• RoHS compliance  Meets RoHS requirements for lead‑free assembly processes.

Why Choose 10M08DFF484C7G?

The 10M08DFF484C7G delivers a practical balance of programmable logic, on‑chip RAM, and I/O capacity in a compact 484‑FBGA package. Its specifications—8,000 logic elements, 387,072 RAM bits, and up to 250 I/Os—make it well suited to designs that need moderate logic density, significant embedded memory, and extensive external connectivity within a commercial temperature envelope.

This device is appropriate for engineers and procurement teams targeting surface-mount FPGA integration where RoHS compliance, a defined voltage supply range (1.15 V–1.25 V), and a clear temperature rating (0 °C–85 °C) are required. Refer to the Intel MAX 10 FPGA device datasheet for detailed electrical, timing, and configuration information.

Request a quote or submit an inquiry for the 10M08DFF484C7G to begin planning your design or to obtain availability and pricing information.