10M08DCU324I7G

The 10M08DCU324I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 324-LFBGA package. It offers a mid-range logic capacity with on-chip RAM and a high I/O count, packaged for surface-mount assembly.

Designed and graded for industrial use, this device provides 8,000 logic elements, 387,072 total RAM bits, 246 I/O pins, a 1.15–1.25 V supply range and an operating temperature range of −40 °C to 100 °C, making it suitable for industrial embedded designs that require reconfigurable logic and robust thermal performance.

Key Features

• MAX® 10 FPGA Core  Intel MAX® 10 FPGA architecture in a compact device for reconfigurable logic implementations.
• Logic Capacity  Approximately 8,000 logic elements to implement a variety of custom logic functions and state machines.
• On-Chip Memory  387,072 total RAM bits for local data buffering, FIFOs, and small embedded memory structures.
• High I/O Count  246 I/O pins to support multiple external interfaces and parallel connections without large external glue logic.
• Power Supply  Narrow core voltage range of 1.15 V to 1.25 V to support targeted power budgeting and supply design.
• Package & Mounting  324-LFBGA package (supplier device package 324-UBGA, 15×15) in a surface-mount form factor for compact PCB layouts.
• Industrial Grade & Temperature Range  Industrial grade device with an operating temperature range of −40 °C to 100 °C for demanding environments.
• RoHS Compliant  Conforms to RoHS requirements for restricted substance use.

Typical Applications

• Industrial Control & Automation  Use the 8,000 logic elements, ample on-chip RAM and 246 I/O to implement custom motor control logic, machine interfaces, and control signal aggregation within industrial equipment.
• Embedded Systems  Integrate into compact embedded platforms where reconfigurable logic, memory and multiple I/O are required in a surface-mount package.
• I/O-Intensive Interfaces  Deploy as an interface hub or protocol bridge where high I/O counts simplify connections to sensors, actuators, and peripheral devices.

Unique Advantages

• Compact, high-density package: The 324-LFBGA (15×15) package enables a small PCB footprint while supporting a large number of I/O and logic resources.
• Balanced logic and memory: 8,000 logic elements combined with 387,072 RAM bits allow integrated handling of control tasks and local buffering without extensive external memory.
• High I/O integration: 246 I/O pins reduce the need for additional interface ICs and simplify board-level routing for multi-channel designs.
• Industrial thermal range: Rated from −40 °C to 100 °C and identified as industrial grade for deployment in temperature-challenging environments.
• Predictable power envelope: A defined 1.15–1.25 V supply range helps streamline power-supply design and thermal planning.

Why Choose 10M08DCU324I7G?

The 10M08DCU324I7G positions itself as a compact, industrial-grade MAX® 10 FPGA option that balances logic capacity, on-chip RAM and a high I/O count within a surface-mount 324-LFBGA package. Its defined supply range and extended operating temperature support stable operation in demanding embedded and industrial environments.

This device is well suited to engineers and procurement teams building mid-density reconfigurable logic solutions that require integrated memory, extensive I/O and a reliable thermal range—delivering a practical path to reduce external components and simplify board design.

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