10M08DCF484C8G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 250 387072 8000 484-BGA |
|---|---|
| Quantity | 191 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 250 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 500 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 387072 |
Overview of 10M08DCF484C8G – MAX® 10 FPGA, 8K Logic Elements, 484-BGA
The 10M08DCF484C8G is an Intel MAX® 10 field programmable gate array (FPGA) device in a 484-ball BGA package. It integrates 8,000 logic elements, on-chip RAM, and extensive I/O to support reconfigurable logic functions for commercial-grade applications.
Designed for use where a commercial-grade FPGA is required, this device provides a balance of logic density, embedded memory (387,072 total RAM bits), and 250 general-purpose I/Os within a compact surface-mount 484-FBGA (23 × 23 mm) package.
Key Features
- Core Logic — 8,000 logic elements suitable for implementing a wide range of custom logic and control functions.
- On-chip Memory — 387,072 total RAM bits provide substantial embedded storage for buffers, state machines, and data processing.
- I/O Capacity — Up to 250 I/Os to interface with peripherals, sensors, and external buses.
- Power — Core voltage supply range of 1.15 V to 1.25 V for device core operation.
- Package & Mounting — 484-FBGA (23 × 23 mm) surface-mount package (484-BGA case) for compact board-level integration.
- Operating Range — Commercial operating temperature range of 0 °C to 85 °C.
- Grade & Speed — Commercial grade device; supported commercial speed grade -C8 per Intel MAX 10 device family documentation.
- Compliance — RoHS compliant for environmental regulatory conformity.
Unique Advantages
- Balanced Logic Density and Memory: 8,000 logic elements combined with 387,072 RAM bits enables mid-density designs that require both logic and embedded storage on a single device.
- High I/O Count: 250 I/Os provide flexible interfacing options to support multi-channel sensor, control, and peripheral connectivity without external GPIO expanders.
- Compact Footprint: 484-FBGA (23 × 23 mm) package reduces board area while keeping pin count high for dense system designs.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C, making this device appropriate for a wide range of commercial electronic products and environments.
- Low-Voltage Core: 1.15 V to 1.25 V core supply supports efficient core power delivery for modern FPGA topologies.
- Regulatory Compliance: RoHS compliance simplifies integration into designs targeting regulated global markets.
Why Choose 10M08DCF484C8G?
The 10M08DCF484C8G positions itself as a commercial-grade MAX 10 FPGA that combines mid-range logic capacity, substantial embedded RAM, and a high I/O count in a space-efficient 484-FBGA package. Its electrical and environmental specifications — including the 1.15 V–1.25 V core supply and 0 °C–85 °C operating range — make it well suited for commercial designs that require reconfigurable logic with on-chip memory and broad interfacing capability.
This device is appropriate for designers seeking a compact, RoHS-compliant FPGA solution from the Intel MAX 10 family, offering a clear specification set for board-level integration and system-level resource planning.
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