10M08DCF484C8G

IC FPGA 250 I/O 484FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 250 387072 8000 484-BGA

Quantity 191 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O250Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs500Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits387072

Overview of 10M08DCF484C8G – MAX® 10 FPGA, 8K Logic Elements, 484-BGA

The 10M08DCF484C8G is an Intel MAX® 10 field programmable gate array (FPGA) device in a 484-ball BGA package. It integrates 8,000 logic elements, on-chip RAM, and extensive I/O to support reconfigurable logic functions for commercial-grade applications.

Designed for use where a commercial-grade FPGA is required, this device provides a balance of logic density, embedded memory (387,072 total RAM bits), and 250 general-purpose I/Os within a compact surface-mount 484-FBGA (23 × 23 mm) package.

Key Features

  • Core Logic — 8,000 logic elements suitable for implementing a wide range of custom logic and control functions.
  • On-chip Memory — 387,072 total RAM bits provide substantial embedded storage for buffers, state machines, and data processing.
  • I/O Capacity — Up to 250 I/Os to interface with peripherals, sensors, and external buses.
  • Power — Core voltage supply range of 1.15 V to 1.25 V for device core operation.
  • Package & Mounting — 484-FBGA (23 × 23 mm) surface-mount package (484-BGA case) for compact board-level integration.
  • Operating Range — Commercial operating temperature range of 0 °C to 85 °C.
  • Grade & Speed — Commercial grade device; supported commercial speed grade -C8 per Intel MAX 10 device family documentation.
  • Compliance — RoHS compliant for environmental regulatory conformity.

Unique Advantages

  • Balanced Logic Density and Memory: 8,000 logic elements combined with 387,072 RAM bits enables mid-density designs that require both logic and embedded storage on a single device.
  • High I/O Count: 250 I/Os provide flexible interfacing options to support multi-channel sensor, control, and peripheral connectivity without external GPIO expanders.
  • Compact Footprint: 484-FBGA (23 × 23 mm) package reduces board area while keeping pin count high for dense system designs.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C, making this device appropriate for a wide range of commercial electronic products and environments.
  • Low-Voltage Core: 1.15 V to 1.25 V core supply supports efficient core power delivery for modern FPGA topologies.
  • Regulatory Compliance: RoHS compliance simplifies integration into designs targeting regulated global markets.

Why Choose 10M08DCF484C8G?

The 10M08DCF484C8G positions itself as a commercial-grade MAX 10 FPGA that combines mid-range logic capacity, substantial embedded RAM, and a high I/O count in a space-efficient 484-FBGA package. Its electrical and environmental specifications — including the 1.15 V–1.25 V core supply and 0 °C–85 °C operating range — make it well suited for commercial designs that require reconfigurable logic with on-chip memory and broad interfacing capability.

This device is appropriate for designers seeking a compact, RoHS-compliant FPGA solution from the Intel MAX 10 family, offering a clear specification set for board-level integration and system-level resource planning.

Request a quote or submit an inquiry for 10M08DCF484C8G to receive pricing and availability information tailored to your volume and delivery needs.

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