10M08DCF484C7G

IC FPGA 250 I/O 484FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 250 387072 8000 484-BGA

Quantity 654 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O250Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs500Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits387072

Overview of 10M08DCF484C7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 250 387072 8000 484-BGA

The 10M08DCF484C7G is a MAX® 10 field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a balanced combination of programmable logic, on-chip RAM, and a high I/O count suitable for a wide range of commercial embedded applications.

Engineered for surface-mount board designs, this device delivers 8,000 logic elements, 387,072 bits of total RAM, and up to 250 I/O pins, enabling compact integration of control, interface, and data-buffering functions while operating within a 1.15 V to 1.25 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • Core Logic — 8,000 logic elements provide the programmable fabric needed for mid-range logic integration and custom digital functions.
  • On-chip Memory — 387,072 total RAM bits for buffering, FIFOs, and embedded data structures to support data-path and control logic needs.
  • I/O Capacity — Up to 250 general-purpose I/O pins to support multiple interfaces, sensors, and peripheral connectivity on a single device.
  • Power — Operates from a 1.15 V to 1.25 V supply, enabling low-voltage system integration.
  • Package and Mounting — 484-BGA package (supplier device package: 484-FBGA (23x23)) designed for surface-mount PCB assembly.
  • Temperature and Grade — Commercial grade operation with an ambient range of 0 °C to 85 °C.
  • Compliance — RoHS compliant for environmental and assembly considerations.

Typical Applications

  • Consumer and Commercial Electronics — Implement user interfaces, display control logic, and device-specific glue logic using the device's logic elements and plentiful I/O.
  • Connectivity and Protocol Bridging — Use available I/O and on-chip RAM to implement protocol translation, buffering, and interface logic between diverse peripherals.
  • Embedded Control and Automation — Integrate control algorithms and sensor aggregation in compact, surface-mount designs leveraging the device's logic and memory resources.
  • Prototyping and System Integration — Validate hardware designs and consolidate discrete components into a single FPGA-based solution in a 484-BGA footprint.

Unique Advantages

  • Balanced Logic Capacity: 8,000 logic elements give designers room to implement complex glue logic and mid-level processing without excessive board-level parts count.
  • Substantial Embedded RAM: 387,072 bits of on-chip RAM enable local buffering and data-path support, reducing external memory requirements.
  • High I/O Count: Up to 250 I/O pins allow multiple peripherals and interfaces to be connected directly to the FPGA, simplifying system architecture.
  • Compact BGA Footprint: 484-BGA (484-FBGA (23x23)) packaging supports dense PCB layouts and surface-mount assembly for space-constrained designs.
  • Low-Voltage Operation: 1.15 V to 1.25 V supply range supports modern low-voltage system rails and power-optimized boards.
  • RoHS Compliant: Environmentally compliant materials and processes support standard commercial manufacturing flows.

Why Choose 10M08DCF484C7G?

The 10M08DCF484C7G positions itself as a versatile, commercially graded FPGA that combines a practical logic count with ample on-chip RAM and a high number of I/O pins in a compact BGA package. It is suited to designers seeking to consolidate interface, control, and buffering functions into a single programmable device while maintaining a low-voltage supply profile.

This device is well matched to design teams building consumer and commercial embedded systems that require scalable logic, significant on-chip memory, and flexible I/O in a surface-mount 484-FBGA form factor. Its commercial temperature rating and RoHS compliance support standard product lifecycles and manufacturing requirements.

Request a quote or submit an inquiry to our sales team for pricing, lead times, and availability of the 10M08DCF484C7G.

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