10M08DCF484C7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 250 387072 8000 484-BGA |
|---|---|
| Quantity | 654 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 250 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 500 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 387072 |
Overview of 10M08DCF484C7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 250 387072 8000 484-BGA
The 10M08DCF484C7G is a MAX® 10 field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a balanced combination of programmable logic, on-chip RAM, and a high I/O count suitable for a wide range of commercial embedded applications.
Engineered for surface-mount board designs, this device delivers 8,000 logic elements, 387,072 bits of total RAM, and up to 250 I/O pins, enabling compact integration of control, interface, and data-buffering functions while operating within a 1.15 V to 1.25 V supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- Core Logic — 8,000 logic elements provide the programmable fabric needed for mid-range logic integration and custom digital functions.
- On-chip Memory — 387,072 total RAM bits for buffering, FIFOs, and embedded data structures to support data-path and control logic needs.
- I/O Capacity — Up to 250 general-purpose I/O pins to support multiple interfaces, sensors, and peripheral connectivity on a single device.
- Power — Operates from a 1.15 V to 1.25 V supply, enabling low-voltage system integration.
- Package and Mounting — 484-BGA package (supplier device package: 484-FBGA (23x23)) designed for surface-mount PCB assembly.
- Temperature and Grade — Commercial grade operation with an ambient range of 0 °C to 85 °C.
- Compliance — RoHS compliant for environmental and assembly considerations.
Typical Applications
- Consumer and Commercial Electronics — Implement user interfaces, display control logic, and device-specific glue logic using the device's logic elements and plentiful I/O.
- Connectivity and Protocol Bridging — Use available I/O and on-chip RAM to implement protocol translation, buffering, and interface logic between diverse peripherals.
- Embedded Control and Automation — Integrate control algorithms and sensor aggregation in compact, surface-mount designs leveraging the device's logic and memory resources.
- Prototyping and System Integration — Validate hardware designs and consolidate discrete components into a single FPGA-based solution in a 484-BGA footprint.
Unique Advantages
- Balanced Logic Capacity: 8,000 logic elements give designers room to implement complex glue logic and mid-level processing without excessive board-level parts count.
- Substantial Embedded RAM: 387,072 bits of on-chip RAM enable local buffering and data-path support, reducing external memory requirements.
- High I/O Count: Up to 250 I/O pins allow multiple peripherals and interfaces to be connected directly to the FPGA, simplifying system architecture.
- Compact BGA Footprint: 484-BGA (484-FBGA (23x23)) packaging supports dense PCB layouts and surface-mount assembly for space-constrained designs.
- Low-Voltage Operation: 1.15 V to 1.25 V supply range supports modern low-voltage system rails and power-optimized boards.
- RoHS Compliant: Environmentally compliant materials and processes support standard commercial manufacturing flows.
Why Choose 10M08DCF484C7G?
The 10M08DCF484C7G positions itself as a versatile, commercially graded FPGA that combines a practical logic count with ample on-chip RAM and a high number of I/O pins in a compact BGA package. It is suited to designers seeking to consolidate interface, control, and buffering functions into a single programmable device while maintaining a low-voltage supply profile.
This device is well matched to design teams building consumer and commercial embedded systems that require scalable logic, significant on-chip memory, and flexible I/O in a surface-mount 484-FBGA form factor. Its commercial temperature rating and RoHS compliance support standard product lifecycles and manufacturing requirements.
Request a quote or submit an inquiry to our sales team for pricing, lead times, and availability of the 10M08DCF484C7G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018