10M08DCF256A7G

The 10M08DCF256A7G is a MAX® 10 FPGA offering a balanced mix of logic, on-chip memory, and I/O in a compact surface-mount package. Built for embedded applications that require a qualified solution, this device provides 8,000 logic elements, 387,072 bits of on-chip RAM and 178 general-purpose I/O pins.

With an operating range from −40 °C to 125 °C and AEC-Q100 qualification, the device targets designs that demand wide temperature operation and automotive-grade reliability while operating at a core voltage of 1.15 V to 1.25 V.

Key Features

• Core Logic  8,000 logic elements to implement combinational and sequential logic functions for control, processing, and custom acceleration tasks.
• On-Chip Memory  387,072 total RAM bits for buffering, FIFOs, and local data storage to support memory-intensive logic functions.
• I/O Density  178 I/O pins to support multiple external interfaces, sensors, and peripheral connections from a single device.
• Package & Mounting  256-LBGA package (supplier device package listed as 256-FBGA, 17 × 17) in a surface-mount form factor for compact board integration.
• Power  Core supply range of 1.15 V to 1.25 V for the device core power domain.
• Temperature & Qualification  Operating temperature −40 °C to 125 °C and AEC-Q100 qualification for automotive-grade use.
• Environmental Compliance  RoHS-compliant to meet common environmental regulations.

Typical Applications

• Automotive Control Modules  AEC-Q100 qualification and wide temperature range make this FPGA suitable for in-vehicle control and processing tasks that require reliable operation across harsh temperature conditions.
• High-Density I/O Interfaces  The 178 I/O pins allow consolidation of multiple sensor and peripheral interfaces, simplifying board-level integration for complex control systems.
• On-Board Data Buffering and Processing  With 387,072 bits of on-chip RAM, the device is suitable for applications requiring local buffering, packet handling, or intermediate data processing.

Unique Advantages

• AEC-Q100 Automotive Qualification: Provides a verified qualification level for automotive applications and teams targeting vehicle-grade deployments.
• Balanced Logic and Memory: 8,000 logic elements combined with substantial on-chip RAM lets designers implement both control logic and local data storage without external memory in many use cases.
• High I/O Count: 178 I/O pins reduce the need for external multiplexing or additional interface components, lowering BOM complexity.
• Wide Operating Temperature: −40 °C to 125 °C operation supports deployment in temperature-extreme environments common in automotive and industrial settings.
• Compact Surface-Mount Package: 256-LBGA/256-FBGA (17 × 17) package enables dense PCB layouts while maintaining a robust soldered attachment.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10M08DCF256A7G?

The 10M08DCF256A7G positions itself as a reliable, automotive-qualified FPGA option that combines a practical logic density with substantial on-chip RAM and a high I/O count. Its AEC-Q100 qualification and wide temperature capability make it a strong choice for engineers designing vehicle-grade and other temperature-challenged embedded systems that require deterministic, locally configurable logic.

This device is well suited to teams aiming to reduce system complexity by integrating control, interface, and buffering functions into a single, surface-mount FPGA—delivering a compact, standards-compliant building block within a familiar FPGA development flow.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the 10M08DCF256A7G and begin integrating this automotive-qualified MAX® 10 FPGA into your next design.