10M08DAU324I7G

IC FPGA 246 I/O 324UBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 246 387072 8000 324-LFBGA

Quantity 548 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-UBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGANumber of I/O246Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs500Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits387072

Overview of 10M08DAU324I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 246 387072 8000 324-LFBGA

The 10M08DAU324I7G is an Intel MAX® 10 field programmable gate array in a 324-LFBGA package. It delivers a combination of programmable logic, on-chip RAM, and a high I/O count for system integration in space-constrained surface-mount designs.

Key device characteristics include 8,000 logic elements, 387,072 total RAM bits, 246 I/O pins, industrial grade operation, a 1.15–1.25 V supply range, and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic resources — 8,000 logic elements and 500 CLBs provide the programmable fabric required for mid-density logic implementation.
  • On-chip memory — 387,072 total RAM bits for embedded buffering, look-up tables, and small data storage without external memory.
  • High I/O count — 246 available I/O pins to support multiple external interfaces and parallel connectivity needs.
  • Power — Core supply range of 1.15 V to 1.25 V to match system power domains.
  • Package & mounting — 324-LFBGA (supplier package: 324-UBGA 15×15) in a surface-mount footprint for compact PCB integration.
  • Industrial operating range — Rated for −40 °C to 100 °C with an Industrial grade designation.
  • Environmental compliance — RoHS compliant.

Unique Advantages

  • Balanced logic and memory — 8,000 logic elements combined with 387,072 RAM bits supports designs that need both programmable logic and embedded memory.
  • Large I/O capacity — 246 I/Os enable flexible connectivity to peripherals, sensors, and external logic without immediate need for I/O expanders.
  • Industrial-ready thermal range — Operation from −40 °C to 100 °C makes the device suitable for deployments in harsh or variable-temperature environments.
  • Compact, manufacturable package — 324-LFBGA (15×15) surface-mount package helps minimize PCB area while supporting automated assembly processes.
  • Low-voltage core — 1.15–1.25 V supply supports modern low-voltage system designs.
  • Standards-aligned — RoHS compliance assists in meeting environmental and regulatory requirements.

Why Choose 10M08DAU324I7G?

The 10M08DAU324I7G positions itself as a capable, mid-density MAX® 10 FPGA option that brings together moderate logic capacity, substantial on-chip RAM, and a high number of I/Os in a compact industrial-grade package. These characteristics make it suitable for designs that require integrated programmable logic, local memory, and extensive external interfacing within a constrained PCB footprint.

Supported by Intel MAX® 10 documentation, this device is appropriate for engineering teams and procurement looking for a documented, RoHS-compliant FPGA platform with industrial temperature capability and a defined supply voltage range.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability details for the 10M08DAU324I7G.

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