10M08DAU324I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 246 387072 8000 324-LFBGA |
|---|---|
| Quantity | 548 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-UBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 246 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 500 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 387072 |
Overview of 10M08DAU324I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 246 387072 8000 324-LFBGA
The 10M08DAU324I7G is an Intel MAX® 10 field programmable gate array in a 324-LFBGA package. It delivers a combination of programmable logic, on-chip RAM, and a high I/O count for system integration in space-constrained surface-mount designs.
Key device characteristics include 8,000 logic elements, 387,072 total RAM bits, 246 I/O pins, industrial grade operation, a 1.15–1.25 V supply range, and an operating temperature range of −40 °C to 100 °C.
Key Features
- Logic resources — 8,000 logic elements and 500 CLBs provide the programmable fabric required for mid-density logic implementation.
- On-chip memory — 387,072 total RAM bits for embedded buffering, look-up tables, and small data storage without external memory.
- High I/O count — 246 available I/O pins to support multiple external interfaces and parallel connectivity needs.
- Power — Core supply range of 1.15 V to 1.25 V to match system power domains.
- Package & mounting — 324-LFBGA (supplier package: 324-UBGA 15×15) in a surface-mount footprint for compact PCB integration.
- Industrial operating range — Rated for −40 °C to 100 °C with an Industrial grade designation.
- Environmental compliance — RoHS compliant.
Unique Advantages
- Balanced logic and memory — 8,000 logic elements combined with 387,072 RAM bits supports designs that need both programmable logic and embedded memory.
- Large I/O capacity — 246 I/Os enable flexible connectivity to peripherals, sensors, and external logic without immediate need for I/O expanders.
- Industrial-ready thermal range — Operation from −40 °C to 100 °C makes the device suitable for deployments in harsh or variable-temperature environments.
- Compact, manufacturable package — 324-LFBGA (15×15) surface-mount package helps minimize PCB area while supporting automated assembly processes.
- Low-voltage core — 1.15–1.25 V supply supports modern low-voltage system designs.
- Standards-aligned — RoHS compliance assists in meeting environmental and regulatory requirements.
Why Choose 10M08DAU324I7G?
The 10M08DAU324I7G positions itself as a capable, mid-density MAX® 10 FPGA option that brings together moderate logic capacity, substantial on-chip RAM, and a high number of I/Os in a compact industrial-grade package. These characteristics make it suitable for designs that require integrated programmable logic, local memory, and extensive external interfacing within a constrained PCB footprint.
Supported by Intel MAX® 10 documentation, this device is appropriate for engineering teams and procurement looking for a documented, RoHS-compliant FPGA platform with industrial temperature capability and a defined supply voltage range.
Request a quote or submit an inquiry to receive pricing, lead-time, and availability details for the 10M08DAU324I7G.

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