10M08DAF484I7G

The 10M08DAF484I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 484-ball FBGA (23×23) surface-mount package. It provides a moderate-density programmable fabric with 8,000 logic elements and 387,072 bits of on-chip RAM, combined with up to 250 user I/Os.

Designed for industrial applications, this device targets embedded and control systems that require configurable logic, significant on-chip memory, and broad I/O connectivity within a compact BGA footprint. Its specified operating range and RoHS compliance support deployment in temperature-challenged, regulated environments.

Key Features

• Logic Capacity  Provides 8,000 logic elements suitable for moderate-complexity programmable logic designs.
• On-Chip Memory  Total of 387,072 bits of RAM for buffering, state storage, and local data processing.
• I/O Count  Up to 250 user I/Os to support multiple interfaces, parallel buses, and peripheral connections.
• Power  Operates from a supply range of 1.15 V to 1.25 V, enabling integration into low-voltage system domains.
• Package & Mounting  484-FBGA (23×23) BGA package in a surface-mount form factor for compact board designs.
• Temperature Range  Industrial operating temperature from −40°C to 100°C for deployment in demanding environments.
• Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Programmable logic and plentiful I/Os support motor control, PLC interfaces, and machine automation within industrial temperature ranges.
• Embedded Systems  On-chip RAM and logic elements enable custom peripheral glue logic, protocol handling, and local data processing in compact embedded designs.
• I/O-Intensive Interfaces  High I/O count accommodates parallel sensor arrays, multi-channel digital interfaces, and complex connector mappings.

Unique Advantages

• Balanced Logic and Memory:  Combines 8,000 logic elements with 387,072 bits of RAM to implement control, buffering, and data-path functions without excessive external components.
• Broad I/O Integration:  250 user I/Os reduce the need for external I/O expanders and simplify board-level design for multi-signal applications.
• Industrial Temperature Specified:  Rated for −40°C to 100°C operation to support deployments in temperature-variable industrial environments.
• Compact BGA Package:  484-FBGA (23×23) enables a compact PCB footprint while supporting high pin density for complex routing.
• Low-Voltage Operation:  1.15 V to 1.25 V supply range facilitates integration with low-voltage system rails.
• RoHS Compliant:  Meets environmental manufacturing standards for broader supply-chain acceptance.

Why Choose 10M08DAF484I7G?

The 10M08DAF484I7G positions itself as a practical, mid-density FPGA choice for designers who need a combination of configurable logic, substantial on-chip RAM, and a large number of user I/Os in a compact BGA package. Its industrial temperature rating and RoHS compliance make it well suited for embedded and industrial applications that demand reliability across a wide thermal range.

Choose this device when your design requires moderate programmable capacity, significant local memory, and flexible I/O integration while maintaining a compact board footprint and adherence to environmental manufacturing standards.

Request a quote or submit a purchase inquiry today to evaluate the 10M08DAF484I7G for your next embedded or industrial application.