10M08DAF256I7G

The 10M08DAF256I7G is a MAX® 10 field programmable gate array (FPGA) designed for industrial applications. It integrates 8,000 logic elements with 387,072 bits of on-chip RAM and up to 178 I/O pins in a compact 256-LBGA package.

With an industrial operating temperature range of −40 °C to 100 °C and a nominal supply window of 1.15 V to 1.25 V, this device targets applications that require robust I/O density, embedded memory capacity, and compact board-level integration.

Key Features

• Logic Capacity  Provides 8,000 logic elements to implement custom digital functions and glue-logic directly on-chip.
• On-Chip Memory  Contains 387,072 total RAM bits to support data buffering, packet handling, and state storage without external memory.
• I/O Density  178 available I/O pins accommodate wide parallel interfaces and multiple peripheral connections from a single device.
• Power  Operates from a supply range of 1.15 V to 1.25 V, enabling designs that target specific low-voltage power domains.
• Package  256-LBGA (256-FBGA 17×17 supplier package) provides a compact footprint for space-constrained boards while supporting high pin-count routing.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet environmental demands typical in industrial deployments.
• Mounting  Surface-mount package suitable for modern PCB assembly flows.
• RoHS Compliance  RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control  Implements custom logic, protocol bridging, and I/O aggregation in factory automation and process-control equipment where extended temperature operation is required.
• Data Buffering and Packet Processing  On-chip RAM supports buffering and staging of data streams for communication or instrument front-ends.
• I/O-Intensive Interfaces  High pin count allows consolidation of multiple parallel or serial interfaces onto a single FPGA for board-level integration.
• Compact Embedded Systems  256-LBGA package enables placement on space-constrained PCBs while providing significant programmable logic and memory resources.

Unique Advantages

• High Logic and Memory Integration: Combines 8,000 logic elements with 387,072 RAM bits to reduce dependence on external components and simplify system architecture.
• Extensive I/O Count: 178 I/O pins support multiple interfaces and sensors directly, lowering BOM and board complexity.
• Industrial Temperature Qualification: Rated from −40 °C to 100 °C to support deployments in harsh or outdoor industrial environments.
• Compact, High-Density Package: 256-LBGA (17×17 FBGA supplier package) offers a small PCB footprint with high pin availability for complex routing.
• Low-Voltage Operation: 1.15 V to 1.25 V supply compatibility helps integrate the FPGA into modern low-voltage system domains.
• RoHS-Compliant: Environmentally compliant construction suitable for standard manufacturing processes.

Why Choose 10M08DAF256I7G?

The 10M08DAF256I7G balances programmable logic capacity, substantial on-chip RAM, and broad I/O availability in a compact industrial-grade package. Its specifications make it well suited to embedded systems and industrial applications that require reliable operation across a wide temperature range and efficient on-board integration of logic and memory functions.

Designers seeking a single-device solution to consolidate I/O, implement custom control logic, and handle memory-intensive tasks will find the 10M08DAF256I7G provides a clear combination of integration, robustness, and board-level density.

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