10M08DAF484C8GES

The 10M08DAF484C8GES is a MAX® 10 field programmable gate array (FPGA) from Intel, offered in a 484‑ball BGA package. It provides a mid-range FPGA fabric with 8,000 logic elements, 387,072 bits of on‑chip RAM and up to 250 I/O, designed for commercial‑grade embedded applications.

With a low core supply voltage (1.15 V to 1.25 V), a compact 23 × 23 mm FBGA footprint, and a 0 °C to 85 °C operating range, this device targets designers building commercial embedded systems and consumer products that require moderate programmable logic capacity and substantial on‑chip memory.

Key Features

• Logic Capacity  Provides 8,000 logic elements and 500 configurable logic blocks (CLBs) to implement combinational and sequential logic functions.
• On‑Chip Memory  387,072 total RAM bits available for FIFOs, buffers, and lookup tables to support data buffering and state storage within the FPGA fabric.
• I/O Density  Up to 250 I/O pins enable rich peripheral connectivity and multiple interface implementations without external GPIO expanders.
• Power and Voltage  Core supply range of 1.15 V to 1.25 V to match system power rails and manage power budgets.
• Package  484‑FBGA (23 × 23 mm) surface‑mount package provides a compact footprint for space‑constrained boards.
• Commercial Grade  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Mounting  Surface‑mount package suitable for automated assembly processes.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Embedded Control  Implement control logic and peripheral interfaces in commercial embedded systems using the device’s 8,000 logic elements and abundant I/O.
• User Interfaces  Drive display controllers, button/key scanning and touch interfaces where on‑chip memory and I/O bandwidth are required for responsive control.
• Prototyping and Development  Serve as a versatile platform for prototyping moderate‑complexity digital designs that require reprogrammability and significant on‑chip RAM.
• Interface Bridging  Consolidate multiple protocol converters and interface logic into a single FPGA leveraging the 250 I/Os and programmable fabric.

Unique Advantages

• Balanced Logic and Memory:  8,000 logic elements combined with 387,072 RAM bits provide a practical balance for designs that need both combinational logic and internal data storage.
• High I/O Count:  Up to 250 I/O pins minimize the need for external I/O expansion, simplifying PCB design and reducing BOM cost.
• Compact BGA Package:  484‑FBGA (23 × 23 mm) package enables dense board layouts while maintaining thermal and mechanical stability for surface‑mount assembly.
• Low‑Voltage Core:  1.15 V to 1.25 V core supply helps systems optimize power distribution and align with modern low‑voltage power rails.
• Commercial Temperature Range:  Specified 0 °C to 85 °C operation fits a wide range of commercial electronics applications.
• Regulatory Compliance:  RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10M08DAF484C8GES?

The 10M08DAF484C8GES offers a practical combination of logic density, on‑chip memory and I/O capacity in a compact 484‑BGA package, tailored for commercial embedded and consumer applications. Its specification set makes it a strong fit for designers who need reprogrammable logic with substantial internal RAM and high I/O connectivity without stepping up to larger device families.

For teams targeting reliable, repeatable designs in the commercial temperature range, this MAX® 10 part delivers a balance of integration and board‑level efficiency that helps reduce external components and simplify system architecture.

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