10M08DAF484C8G

The 10M08DAF484C8G is an Intel MAX® 10 FPGA device provided in a 484-ball BGA package. It integrates logic, on-chip memory, and a high I/O count in a commercial-grade, surface-mount form factor suitable for embedded electronic designs.

With 8000 logic elements, 387072 total RAM bits, and up to 250 user I/Os, this device is designed for commercial applications that require mid-range programmable logic density, flexible I/O routing, and a compact 484-FBGA (23×23) package. It operates from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 8000 logic elements to implement combinational and sequential logic functions within a mid-density FPGA fabric.
• On‑Chip Memory — 387072 bits of total RAM for buffering, FIFOs, and small data stores directly inside the FPGA.
• I/O Density — 250 user I/Os to support multiple parallel interfaces, general-purpose signals, and board-level connectivity.
• Power Supply — Core supply voltage range of 1.15 V to 1.25 V, enabling predictable power budgeting for the FPGA core.
• Package & Mounting — 484-ball FBGA (23×23) package in a surface-mount form factor for compact board integration.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, meeting common environmental directive requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Implement control logic, glue logic, and custom accelerators in space-constrained commercial products.
• Consumer Electronics — Manage user interface control, peripheral aggregation, and protocol bridging where moderate logic and memory are required.
• Communications Equipment — Provide flexible I/O and on-chip memory for packet buffering, framing, or interface adaptation in commercial networking devices.
• Prototyping and Development Platforms — Use the device for proof-of-concept designs that require reprogrammable logic and a mid-range I/O count.

Unique Advantages

• Balanced Logic and Memory: 8000 logic elements paired with 387072 RAM bits deliver a balanced resource mix for control, buffering, and stateful functions.
• High I/O Count: 250 user I/Os support multiple parallel interfaces and flexible board-level connectivity without external multiplexing.
• Compact Package: 484-FBGA (23×23) provides a high-density footprint for designs where PCB area is at a premium.
• Commercial-Grade Operating Range: 0 °C to 85 °C rating aligns the device to a wide range of commercial product deployments.
• Predictable Power Envelope: Defined core voltage range (1.15 V to 1.25 V) simplifies core power supply design and budgeting.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and common environmental requirements.

Why Choose 10M08DAF484C8G?

The 10M08DAF484C8G MAX® 10 FPGA is positioned for commercial designs that need a mid-density programmable logic device with substantial I/O and on-chip memory in a compact BGA package. Its combination of 8000 logic elements, 387072 bits of RAM, and 250 I/Os makes it suitable for a broad set of embedded applications where integration and board-space efficiency matter.

Choose this device when you need a commercially graded FPGA backed by Intel MAX® 10 device documentation and datasheet guidance, with clear electrical parameters for supply voltage and operating temperature to support predictable integration into your product designs.

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