10M08DAF256C8GES

The 10M08DAF256C8GES is a MAX® 10 Field Programmable Gate Array (FPGA) designed for commercial embedded applications. It combines a mid-range logic capacity with on-chip RAM and flexible I/O in a compact 256-ball BGA package.

With 8,000 logic elements, 387,072 total RAM bits and 178 I/O, this device targets cost-sensitive commercial designs that require integration, moderate logic density and a compact surface-mount footprint. It operates from a 1.15 V to 1.25 V supply and is specified for 0 °C to 85 °C operation.

Key Features

• Core Logic  8,000 logic elements provide mid-range programmable logic capacity suitable for control, glue-logic and embedded processing tasks.
• On-chip Memory  387,072 total RAM bits enable local data buffering, FIFOs and small memory structures without external RAM.
• I/O Density  178 I/O pins support multiple parallel interfaces and mixed-signal front-end connectivity in compact designs.
• Power  Single-core voltage supply range of 1.15 V to 1.25 V to match system power-rail requirements.
• Package & Mounting  256-ball BGA package case with supplier device package listed as 256-FBGA (17×17); surface-mount mounting for high-density PCB designs.
• Operating Range  Commercial grade operating temperature from 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance  RoHS-compliant device meeting common environmental requirements for electronic assemblies.

Typical Applications

• Commercial Embedded Systems  Integrate control logic and interfaces where 8,000 logic elements and on-chip RAM reduce external component count.
• Interface Bridging  Use the 178 I/O pins to implement parallel/serial bridging or protocol translation in compact assemblies.
• Industrial-style User Interfaces (Commercial Grade)  Implement display drivers, key scanning and local control logic within a commercial temperature range.

Unique Advantages

• Balanced Logic and Memory:  8,000 logic elements paired with 387,072 RAM bits provide a practical mix of compute and storage for many embedded tasks.
• High I/O Count in a Compact Package:  178 I/O in a 256-ball BGA (17×17) footprint helps maintain PCB density while offering interface flexibility.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C operation aligns with standard commercial deployments and indoor equipment.
• Surface-Mount Ready:  BGA package and surface-mount mounting simplify assembly for automated manufacturing processes.
• RoHS Compliant:  Meets environmental compliance expectations for many commercial products and supply chains.

Why Choose 10M08DAF256C8GES?

The 10M08DAF256C8GES positions itself as a cost-effective, integrated FPGA option for commercial embedded designs that require a moderate logic footprint, significant on-chip RAM, and a high I/O count in a compact surface-mount package. Its supply voltage range and commercial temperature rating make it suitable for mainstream commercial electronics and system control functions.

This device is well suited to designers seeking to minimize external components while maintaining flexible I/O connectivity and on-chip memory. Its combination of logic resources, RAM and packaging supports scalable designs and streamlined BOMs for commercial products.

Request a quote or submit an inquiry to receive pricing, availability and additional ordering information for 10M08DAF256C8GES.