10M04SFE144I7G

The 10M04SFE144I7G is an Intel MAX® 10 FPGA in a 144‑lead LQFP exposed‑pad package, designed for industrial-grade embedded logic implementations. It integrates up to 4,000 logic elements and 193,536 bits of on-chip RAM to support mid-density programmable logic tasks.

With 101 dedicated I/O pins, a surface‑mount 144‑EQFP (20×20) footprint, and an operating range from –40 °C to 100 °C, this device is suited for designs that require substantial I/O connectivity and on-chip memory within an industrial temperature envelope.

Key Features

• Logic Capacity  Provides 4,000 logic elements to implement custom digital logic and control functions.
• On‑Chip Memory  Includes 193,536 total RAM bits for data buffering, state storage, and local memory needs.
• I/O Count  101 I/O pins to support multiple peripherals, interfaces, and board-level connectivity.
• Package & Mounting  144‑LQFP exposed pad (supplier device package: 144‑EQFP, 20×20) in a surface‑mount configuration for standard PCB assembly.
• Voltage Supply  Operates from 2.85 V to 3.465 V, enabling use with common 3.3 V systems and level domains within that range.
• Industrial Grade Operation  Specified for industrial grade use with an operating temperature range of –40 °C to 100 °C.
• Regulatory  RoHS‑compliant material status.

Typical Applications

• Industrial Control  Implement control logic and I/O interfacing where an operating range of –40 °C to 100 °C and industrial grade components are required.
• Protocol Bridging and Interface  Use the 101 I/Os to convert or bridge multiple board‑level interfaces and peripherals.
• Local Data Buffering  Leverage 193,536 bits of on‑chip RAM for buffering, small FIFO storage, or state retention within embedded systems.
• Embedded Logic and Glue  Deploy up to 4,000 logic elements to integrate glue logic, custom accelerators, or control state machines on the PCB.

Unique Advantages

• Balanced Logic and Memory: Combines 4,000 logic elements with 193,536 bits of RAM to support designs that need both programmable logic and local memory.
• High I/O Count: 101 available I/Os enable flexible interfacing to sensors, peripherals, and other ICs without external IO expanders.
• Industrial Temperature Range: Specified operation from –40 °C to 100 °C addresses demanding environmental requirements.
• Standard Surface‑Mount Package: 144‑LQFP exposed pad in a 20×20 EQFP footprint simplifies PCB layout and thermal management for medium‑density applications.
• Wide Supply Range: 2.85 V to 3.465 V support allows straightforward integration into 3.3 V systems and level domains within that range.
• RoHS‑Compliant: Meets common material compliance requirements for modern manufacturing.

Why Choose 10M04SFE144I7G?

The 10M04SFE144I7G positions itself as a mid‑density, industrial‑grade FPGA option that brings together a useful mix of logic density, on‑chip RAM, and I/O capability in a compact 144‑lead exposed‑pad package. Its specified operating range and RoHS compliance make it a practical choice for embedded designs that require reliable operation across broad temperatures.

This device is well suited for engineers and procurement teams seeking a MAX® 10 FPGA with clear, verifiable specifications for logic elements, memory, I/O count, supply range, and package type—supporting scalable designs where on‑chip resources and industrial operation are priorities.

If you would like pricing, availability, or a formal quote for the 10M04SFE144I7G, submit a request and our team will respond with the next steps to procure this device.