10M08DAF256A7G

The 10M08DAF256A7G is an Intel MAX® 10 field programmable gate array provided in a 256‑LBGA package. It combines 8,000 logic elements with on‑chip RAM and flexible I/O to support compact, low‑voltage FPGA implementations.

This device is offered in an automotive grade with AEC‑Q100 qualification and supports operation across a wide temperature range, making it suitable for designs that require robust performance in challenging environments.

Key Features

• Logic Capacity — 8,000 logic elements to implement custom logic, glue logic, and moderate-density IP.
• On‑chip Memory — 387,072 total RAM bits for embedded data storage, FIFOs, and buffering.
• I/O Count — 178 I/O pins for flexible interfacing to sensors, transceivers, and peripheral devices.
• Package and Mounting — 256‑LBGA package (supplier device package: 256‑FBGA, 17×17) in a surface‑mount format for compact board integration.
• Voltage Supply — Core operating range of 1.15 V to 1.25 V to support low‑voltage system architectures.
• Temperature Range & Qualification — Rated for operation from −40°C to 125°C and qualified to AEC‑Q100 (automotive grade).
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive Electronic Modules — Automotive‑grade qualification (AEC‑Q100) and −40°C to 125°C operation allow deployment in temperature‑sensitive vehicle electronics.
• Embedded Control and I/O Expansion — 178 I/Os and 8,000 logic elements enable custom control logic, protocol bridging, and interface aggregation on constrained PCBs.
• On‑board Data Buffering and Processing — 387,072 bits of on‑chip RAM support buffering, small FIFOs, and local data handling near sensors or transceivers.

Unique Advantages

• Automotive Qualification: AEC‑Q100 qualification and extended temperature rating provide traceable suitability for automotive environments.
• Compact, High‑I/O Package: 256‑LBGA (17×17 FBGA) delivers a high pin count in a space‑efficient surface‑mount footprint for dense board designs.
• Low‑Voltage Core: Narrow core supply range (1.15 V to 1.25 V) supports modern low‑power system rails and power‑supply optimization.
• On‑chip Memory Capacity: Nearly 387k bits of RAM reduce the need for external memory in many control and buffering use cases.
• Broad I/O Flexibility: 178 I/Os allow integration with a wide range of peripherals and interfaces without additional bridge devices.
• Regulatory Compliance: RoHS compliance facilitates use in products targeting global markets with environmental requirements.

Why Choose 10M08DAF256A7G?

The 10M08DAF256A7G positions itself as a compact, automotive‑qualified FPGA option that balances logic density, on‑chip RAM, and a high I/O count in a 256‑LBGA package. Its low core voltage and AEC‑Q100 qualification make it appropriate for designs that must meet automotive environmental and thermal demands.

This device is well suited to engineers seeking a reliable, mid‑density FPGA for embedded control, interface aggregation, and on‑board data handling where space, temperature resilience, and I/O flexibility are key considerations.

Request a quote or submit an RFQ to receive pricing and availability information for the 10M08DAF256A7G.