10M08DAF256C7G

The 10M08DAF256C7G is an Intel MAX® 10 FPGA in a commercial‑grade package designed for configurable digital logic integration. It offers 8,000 logic elements, 387,072 bits of on‑chip RAM, and up to 178 I/O pins to support dense, I/O‑rich designs.

Targeted at commercial embedded applications, this device provides a balance of integration, I/O capacity, and a compact 256‑ball BGA footprint for surface‑mount assembly. The device is specified for a core supply range of 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 8,000 logic elements suitable for moderate-complexity programmable logic implementations.
• On‑chip Memory  Includes 387,072 total RAM bits for embedded buffering, state storage, and small data structures.
• I/O Density  Up to 178 I/O pins to support parallel interfaces, multiple peripherals, and board-level connectivity.
• Package  256‑LBGA package; supplier device package listed as 256‑FBGA (17×17) for compact board integration and surface‑mount assembly.
• Power  Core voltage supply specified from 1.15 V to 1.25 V for predictable power budgeting.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance  Surface mount package and RoHS compliant construction.
• Series & Grade  Part of the Intel MAX 10 FPGA family; the device suffix C7 indicates the commercial speed grade supported by the MAX 10 datasheet.

Typical Applications

• Commercial Embedded Systems  Suitable for designs that require up to 8,000 logic elements and 178 external I/Os for control, glue logic, and protocol handling.
• Interface Bridging  Useful where on‑chip RAM (387,072 bits) and a high pin count are needed to buffer or bridge between peripherals and processors.
• Custom Logic & Prototyping  Compact 256‑ball BGA footprint supports rapid development of custom logic functions in space‑constrained commercial products.

Unique Advantages

• Balanced Logic and Memory:  8,000 logic elements paired with 387,072 bits of RAM enable implementation of both control logic and local data storage without external memory in many use cases.
• High I/O Count:  178 I/O pins provide flexibility to interface multiple peripherals and parallel busses directly to the FPGA fabric.
• Compact Surface‑Mount Package:  256‑LBGA (256‑FBGA, 17×17) minimizes board area while supporting robust soldered mounting for commercial assemblies.
• Predictable Power Envelope:  Documented core supply range of 1.15 V to 1.25 V supports accurate power budgeting and thermal planning.
• Commercial Temperature Rating:  0 °C to 85 °C operation aligns with a wide range of commercial product deployment scenarios.
• RoHS Compliant:  Meets RoHS requirements for materials compliance in commercial electronic products.

Why Choose 10M08DAF256C7G?

The 10M08DAF256C7G offers a practical combination of logic capacity, on‑chip memory, and high I/O density in a compact 256‑ball BGA package, making it well suited for commercial embedded designs that need configurable logic and local RAM without adding external components. As a MAX 10 family device with a commercial C7 speed grade, it is supported by the Intel MAX 10 FPGA device datasheet, which provides the detailed electrical and timing specifications needed for system design and integration.

This part is appropriate for engineers and procurement teams looking for a commercial‑grade FPGA that balances integration and board space efficiency while providing clear supply voltage and temperature specifications for predictable system behavior.

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