10M08DAF256C8G

The Intel MAX® 10 FPGA 10M08DAF256C8G is a commercially graded, surface-mount programmable logic device that integrates 8,000 logic elements, 387,072 bits of embedded RAM and 178 I/O in a 256-LBGA (17×17) package. It is supplied with a core voltage range of 1.15 V to 1.25 V and is specified for operation from 0 °C to 85 °C.

Detailed electrical characteristics, switching and configuration timing are provided in the device datasheet, making this part suitable for commercial embedded designs that require moderate logic density, on-chip memory and a high I/O count in a compact package.

Key Features

• Core Logic 8,000 logic elements for implementing combinational and sequential logic functions.
• On-chip Memory 387,072 total RAM bits to support buffers, FIFOs and small data structures without external memory.
• High I/O Count 178 I/Os to support multiple interfaces and parallel connections in a single device.
• Package & Mounting 256-LBGA (17×17) surface-mount package for compact board-level integration.
• Power Core voltage supply range of 1.15 V to 1.25 V for the FPGA fabric.
• Operating Conditions & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant.
• Configuration & Timing Documentation Datasheet includes electrical characteristics, switching characteristics, configuration specifications and timing parameters to support system design and validation.

Unique Advantages

• Moderate logic capacity: 8,000 logic elements provide the ability to implement mid-range logic functions without external programmable logic.
• Significant on‑chip RAM: 387,072 bits of embedded RAM reduce the need for external memory for many buffering and data-processing tasks.
• High I/O integration: 178 I/Os enable multiple parallel interfaces and flexible pin assignments for system-level integration.
• Compact surface-mount package: 256-LBGA (17×17) package supports dense PCB designs while maintaining a small board footprint.
• Commercial temperature suitability: 0 °C to 85 °C rating aligns with a wide range of commercial embedded applications.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 10M08DAF256C8G?

The 10M08DAF256C8G balances logic capacity, embedded RAM and I/O count in a compact 256-LBGA package, making it appropriate for commercial embedded systems that need moderate programmable logic, on-chip memory and numerous external connections. Its documented electrical, switching and configuration specifications simplify integration and validation during development.

This device is suited to designers and procurement teams seeking a commercially graded MAX® 10 FPGA with verifiable specifications for voltage, temperature and package characteristics, offering a practical option for mid-density programmable logic needs.

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