10M04SCU324C8G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA |
|---|---|
| Quantity | 6 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-UBGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 246 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 193536 |
Overview of 10M04SCU324C8G – MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA
The 10M04SCU324C8G is an Intel MAX® 10 field-programmable gate array supplied in a 324-LFBGA surface-mount package. The device provides 4,000 logic elements, 193,536 bits of on-chip RAM and 246 user I/Os for compact, programmable digital logic implementations.
Manufactured for commercial use, the device operates over a 0 °C to 85 °C temperature range with a supply voltage range of 2.85 V to 3.465 V. The part is RoHS compliant and is packaged as a 324-UBGA (15×15) offering a high I/O count in a compact BGA footprint.
Key Features
- Core Logic 4,000 logic elements for implementing custom digital functions and combinational/sequential logic.
- On-chip Memory 193,536 total RAM bits available for data buffering, FIFOs, and embedded storage.
- I/O Count 246 user I/O pins to support multiple parallel interfaces and external connectivity.
- Power Supply Operates from 2.85 V to 3.465 V supply range to match common system power rails.
- Package & Mounting 324-LFBGA package (supplier device package: 324-UBGA, 15×15) designed for surface-mount assembly.
- Operating Conditions Commercial grade device with operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
- Datasheet Coverage Manufacturer datasheet provides electrical characteristics, switching characteristics, configuration specifications, and timing information for MAX 10 devices.
Typical Applications
- Embedded control and glue logic Use where up to 4,000 logic elements and rich I/O are required to implement custom control, protocol conversion, or system glue functions.
- Interface aggregation High I/O count supports consolidating multiple parallel or serial interfaces in a single programmable device.
- On-board buffering and data handling On-chip RAM (193,536 bits) enables local buffering, small FIFOs, and temporary data storage for tight system integration.
Unique Advantages
- High logic density in a compact package: 4,000 logic elements in a 324-LFBGA footprint allow substantial functionality without a large PCB area.
- Significant on-chip RAM: 193,536 bits of RAM reduce the need for external memory for many buffering and data path tasks.
- Extensive I/O availability: 246 I/Os provide flexibility for parallel interfaces, control signals, and multiple peripherals.
- Commercial operating range: Rated for 0 °C to 85 °C, matching common commercial electronics deployment conditions.
- RoHS compliant: Conforms to current lead-free and environmental regulations for electronics manufacturing.
- Comprehensive technical documentation: Datasheet details electrical, switching, and configuration timing to support system-level integration and validation.
Why Choose 10M04SCU324C8G?
The 10M04SCU324C8G delivers a balanced combination of programmable logic, on-chip memory, and high I/O density in a commercial-grade MAX 10 FPGA. Its 4,000 logic elements and 193,536 bits of RAM provide the building blocks needed for compact, reprogrammable digital designs while the 246 I/Os enable broad interface flexibility.
This device is well suited to teams and designs that require a compact BGA package, substantial user I/O, and on-chip memory resources within a defined commercial temperature and voltage envelope. Detailed manufacturer documentation on electrical and timing characteristics supports reliable system integration and validation.
Request a quote or submit an inquiry for pricing and availability of the 10M04SCU324C8G to move your design forward.

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