10M04SCU169A7G

The 10M04SCU169A7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel, supplied in a 169-LFBGA surface-mount package. This AEC-Q100 qualified, automotive-grade device combines reconfigurable logic, on-chip RAM, and a high I/O count for designs that require dependable operation across a wide temperature range.

With 4,000 logic elements, 193,536 total RAM bits and 130 I/O, the device targets applications that need moderate logic capacity, significant on-chip memory, and robust electrical and thermal operating margins.

Key Features

• Core Logic  Approximately 4,000 logic elements to implement configurable digital logic and control functions.
• On-Chip Memory  193,536 total RAM bits for buffering, small data storage and state machines within the FPGA fabric.
• I/O Density  130 I/O pins to support multiple signal interfaces and peripheral connections directly from the device.
• Automotive Qualification  AEC-Q100 qualification and designated automotive grade for use in vehicle electronics.
• Wide Operating Temperature  Rated for operation from −40 °C to 125 °C to meet extended-temperature system requirements.
• Supply Voltage Range  Operates on a 2.85 V to 3.465 V supply range to match common automotive and embedded power rails.
• Package and Mounting  169-LFBGA (169-UBGA, 11×11) surface-mount package for compact PCB implementations.

Typical Applications

• Automotive Electronic Systems  AEC-Q100 qualification and wide temperature range make this FPGA suitable for vehicle control units and automotive electronics requiring reconfigurable logic.
• I/O-Intensive Interfaces  High pin count (130 I/O) supports designs that require multiple sensor, actuator or communication interfaces.
• Embedded Memory-Centric Logic  193,536 RAM bits enable buffering and on-chip data handling for control algorithms and stateful logic.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 rating provides a verified qualification profile for automotive hardware designs.
• Balanced Logic and Memory: 4,000 logic elements combined with substantial on-chip RAM allow integration of control logic and data buffering without external memory in many designs.
• High I/O Count: 130 I/O pins reduce the need for external expanders when interfacing multiple signals or peripherals.
• Extended Temperature Range: −40 °C to 125 °C operation supports deployment in thermally demanding environments.
• Compact, Surface-Mount Package: 169-LFBGA (11×11 UBGA) offers a space-efficient footprint for dense PCB layouts.
• Flexible Powering: A 2.85 V to 3.465 V supply range aligns with common system power domains.

Why Choose 10M04SCU169A7G?

The 10M04SCU169A7G positions itself as a practical, automotive-qualified FPGA option that combines reconfigurable logic, significant on-chip RAM, and substantial I/O in a compact LFBGA package. Its specification set—4,000 logic elements, 193,536 RAM bits, 130 I/O, AEC-Q100 qualification, and −40 °C to 125 °C rating—makes it well suited for designers building vehicle electronics and other temperature-sensitive embedded systems that demand reliable, reconfigurable logic.

As part of the MAX® 10 family from Intel, the device is intended for teams seeking a balance of integration, predictable electrical requirements, and package-level density for midsize FPGA designs.

Request a quote or submit your requirements today to learn more about availability and pricing for 10M04SCU169A7G. Our team can provide a formal quote and technical ordering details to support your design evaluation.