10M04SCE144I7G

The 10M04SCE144I7G is a MAX® 10 FPGA device designed for embedded logic integration in industrial environments. It delivers a balance of programmable logic capacity, on‑chip memory, and flexible I/O in a compact 144‑LQFP exposed pad package.

With 4,000 logic elements, 193,536 bits of RAM, and 101 I/O pins, this device is suited for applications that require medium-density programmable logic, deterministic I/O interfacing, and reliable operation across an industrial temperature range.

Key Features

• Core Logic  4,000 logic elements provide the configurable resources needed for glue logic, control functions, and moderate combinational/sequential logic tasks.
• Memory  193,536 total RAM bits available on‑chip for packet buffering, small FIFOs, state machines, and temporary data storage.
• I/O Count  101 I/O pins support a wide range of external interfaces and peripheral connections for sensors, actuators, and communication modules.
• Voltage Supply  Operates from 2.85 V to 3.465 V, enabling integration with common 3.3 V system power rails.
• Package & Mounting  144‑LQFP (exposed pad) surface‑mount package in a 20 × 20 footprint for PCB designs requiring a compact, thermally aided package.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial applications.
• Regulatory  RoHS compliant for lead‑free assembly and global environmental requirements.

Typical Applications

• Industrial Control & Automation  Use the device's industrial temperature rating and ample I/O count to implement control logic, sensor interfacing, and machine coordination functions.
• Embedded System Glue Logic  Provide mid‑density programmable logic and on‑chip RAM for protocol bridging, timing control, and peripheral aggregation.
• Communication Interfaces  Leverage the 101 I/Os and internal RAM for custom interface logic, buffering, and lightweight protocol handling.

Unique Advantages

• Balanced Logic and Memory: 4,000 logic elements combined with 193,536 RAM bits deliver practical capacity for mid‑range FPGA designs without excessive board space.
• Ample I/O Density: 101 I/O pins simplify connections to sensors, actuators, and external peripherals, reducing the need for additional interface components.
• Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Compact, Thermally Aware Package: The 144‑LQFP exposed pad package provides a small PCB footprint while aiding thermal dissipation for sustained operation.
• 3.3 V System Compatibility: The 2.85 V to 3.465 V supply range aligns with common 3.3 V system rails for straightforward power integration.
• RoHS Compliant: Facilitates lead‑free manufacturing and helps simplify regulatory compliance for assemblies.

Why Choose 10M04SCE144I7G?

The 10M04SCE144I7G positions itself as a practical choice for engineers needing a mid‑density FPGA with solid on‑chip memory and a high I/O count in an industrial‑rated package. Its combination of 4,000 logic elements, nearly 200k bits of RAM, and 101 I/Os makes it well suited to embedded control, interface bridging, and other applications where integration and reliability matter.

Part of the MAX® 10 family, the device offers designers a compact, manufacturable solution that balances logic capacity, memory resources, thermal considerations, and supply‑voltage compatibility for long‑term deployed systems.

Request a quote or submit your pricing and availability inquiry to move your design forward with the 10M04SCE144I7G.