10M04SCE144A7G

The 10M04SCE144A7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 144‑lead LQFP exposed pad package. It integrates 4,000 logic elements and 193,536 bits of on‑chip RAM to support mid-density programmable logic and embedded memory needs.

Designed for systems requiring a broad I/O count and automotive qualification, this surface‑mount device supports a 2.85 V to 3.465 V supply range and an operating temperature window from −40 °C to 125 °C, with AEC‑Q100 qualification for automotive applications.

Key Features

• Logic Capacity — 4,000 logic elements to implement mid-density custom logic, glue logic, and control functions.
• On‑Chip Memory — 193,536 total RAM bits for buffering, lookup tables, and small data structures without external memory.
• I/O Count — 101 I/O pins to support multiple interfaces and peripheral connections in compact designs.
• Package and Mounting — 144‑LQFP with exposed pad; supplier device package listed as 144‑EQFP (20×20); surface mount for PCB assembly.
• Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for use in automotive environments.
• Voltage and Temperature — Supply range 2.85 V to 3.465 V and operating temperature −40 °C to 125 °C for wide‑range system compatibility.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Balanced logic and memory mix: 4,000 logic elements combined with 193,536 RAM bits lets you implement both control logic and significant on‑chip data storage without relying solely on external memory.
• High I/O density in a compact package: 101 I/Os in a 144‑lead LQFP exposed pad package enables rich connectivity while keeping board footprint manageable.
• Automotive‑grade reliability: AEC‑Q100 qualification and a −40 °C to 125 °C operating range support deployment in automotive and other demanding temperature environments.
• Broad supply compatibility: Support for a 2.85 V to 3.465 V supply range allows integration into a variety of system power architectures.
• Surface‑mount package with thermal pad: The exposed pad LQFP package aids thermal performance and reliable solder mounting for production assembly.
• Standards‑oriented compliance: RoHS compliance simplifies environmental and regulatory alignment for product development.

Why Choose 10M04SCE144A7G?

The 10M04SCE144A7G positions itself as a mid‑density FPGA option for designs that need a practical balance of logic, embedded RAM, and I/O in an automotive‑qualified package. Its combination of 4,000 logic elements, substantial on‑chip RAM, and 101 I/Os makes it suitable for control, interfacing, and data buffering functions in space‑constrained systems.

With AEC‑Q100 qualification, a wide operating temperature range, and an exposed‑pad LQFP surface‑mount package, this device offers long‑term value for projects targeting automotive or other temperature‑sensitive applications that require proven compliance and reliable integration into existing power domains.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the 10M04SCE144A7G. Our team can provide component-level details and support for your design review and procurement process.