10M04SAU169I7G

IC FPGA 130 I/O 169UBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 130 193536 4000 169-LFBGA

Quantity 374 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package169-UBGA (11x11)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case169-LFBGANumber of I/O130Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits193536

Overview of 10M04SAU169I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC, 4,000 Logic Elements, 169-LFBGA

The 10M04SAU169I7G is an Intel MAX® 10 field programmable gate array provided in a 169-LFBGA (169-UBGA, 11×11) package. This industrial-grade FPGA combines 4,000 logic elements, 193,536 bits of on-chip RAM, and 130 I/O pins in a surface-mount package for embedded control and programmable logic integration.

Designed for use where temperature range, I/O count, and on-chip memory density matter, the device supports a 2.85 V to 3.465 V supply and an operating temperature range of −40 °C to 100 °C, offering a compact programmable fabric for industrial applications.

Key Features

  • Logic Capacity  4,000 logic elements (logic cells) to implement custom digital logic, state machines, and control functions.
  • On‑Chip Memory  193,536 total RAM bits of embedded memory for data buffering, FIFOs, and small lookup tables without external RAM.
  • I/O Density  130 I/O pins provided on the 169‑LFBGA package to support multiple peripheral interfaces and system signals.
  • Power Supply  Operates from a 2.85 V to 3.465 V supply range to match common system voltage domains.
  • Industrial Grade & Temperature Range  Specified for industrial operation from −40 °C to 100 °C for deployment in harsher environments.
  • Package & Mounting  169‑LFBGA (169‑UBGA, 11×11) surface-mount package for space-constrained PCBs and automated assembly.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Unique Advantages

  • Compact programmable fabric: 4,000 logic elements and substantial on-chip RAM deliver a balance of logic and memory in a small 169‑LFBGA footprint to save PCB area.
  • High I/O count in a small package: 130 I/O pins on an 11×11 UBGA package enable multiple peripheral connections without larger packages.
  • Industrial temperature support: −40 °C to 100 °C operating range helps ensure reliable operation in industrial environments.
  • Flexible supply range: 2.85 V to 3.465 V compatibility simplifies integration into systems using common voltage rails.
  • Surface-mount package for automated assembly: 169‑LFBGA surface-mount form factor supports automated production and compact system designs.
  • Regulatory alignment: RoHS compliance aligns with environmental and materials requirements for modern electronics manufacturing.

Why Choose 10M04SAU169I7G?

The 10M04SAU169I7G positions itself as a practical FPGA option where a moderate logic capacity, generous on-chip RAM, and a high I/O count are required in a compact, industrial-temperature package. Its combination of 4,000 logic elements, 193,536 RAM bits, and 130 I/O pins makes it suitable for embedded control, custom interfacing, and programmable system tasks that must tolerate wider temperature ranges and standard system voltages.

For engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with predictable temperature performance and a compact 169‑LFBGA footprint, the 10M04SAU169I7G offers a verifiable specification set that supports integration into industrial designs while minimizing external memory and I/O routing needs.

Request a quote or submit an RFQ to obtain pricing and lead-time information for the 10M04SAU169I7G.

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