10M04SAU324C8G

The 10M04SAU324C8G is an Intel MAX® 10 FPGA in a 324-LFBGA (324-UBGA 15×15) surface-mount package, providing a compact, commercially graded programmable logic solution. It combines 4,000 logic elements with 193,536 bits of on-chip RAM and up to 246 I/O pins to support medium-density logic, interface consolidation, and embedded control functions.

Designed for commercial-temperature applications (0 °C to 85 °C), the device operates from a 1.15 V to 1.25 V supply and is RoHS compliant, offering a concise feature set for space-constrained boards that require a balance of logic capacity, memory, and I/O connectivity.

Key Features

• Core Logic  4,000 logic elements provide programmable fabric for implementing combinational and sequential logic, state machines, and glue logic.
• On‑Chip Memory  193,536 total RAM bits for local buffering, FIFOs, and small data structures without external memory.
• I/O Density  Up to 246 user I/O pins to support multiple interfaces and peripheral connections on a single device.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power rails and support low-voltage designs.
• Package & Mounting  324-LFBGA (324-UBGA, 15×15) surface-mount package for compact board integration and high pin count in a small footprint.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C, suitable for general-purpose commercial applications.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Programmable logic and on-chip RAM enable control, glue logic, and moderate computation tasks within commercial embedded products operating in 0 °C to 85 °C environments.
• I/O‑Rich Interface Modules  With up to 246 I/O pins, the device is suited to consolidate multiple peripheral interfaces and simplify board-level routing.
• Local Data Buffering and Control  On-chip RAM (193,536 bits) supports buffering, small FIFOs, and local data handling to reduce external memory dependency.

Unique Advantages

• Balanced Logic and Memory: 4,000 logic elements paired with 193,536 RAM bits delivers a practical combination for medium-density designs that need both logic and on-chip storage.
• High I/O Count: 246 I/O pins allow consolidation of multiple interfaces and peripherals onto a single FPGA, reducing external glue components.
• Compact, High‑Pin Package: 324-LFBGA (15×15) surface-mount package provides a high pin count in a small board area for space-constrained designs.
• Low‑Voltage Core: Narrow core supply range (1.15 V–1.25 V) simplifies power-rail design for systems using modern low-voltage domains.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet requirements of general commercial products and systems.
• RoHS Compliant: Conforms to RoHS directives for environmentally conscious manufacturing.

Why Choose 10M04SAU324C8G?

The 10M04SAU324C8G positions itself as a versatile, commercially graded FPGA option for designers who need a balanced mix of logic capacity, on-chip RAM, and a high I/O count in a compact surface-mount package. Its combination of 4,000 logic elements, nearly 200k bits of RAM, and 246 I/Os makes it well suited for medium-complexity embedded tasks and interface consolidation on space-limited PCBs.

For teams building commercial electronic products that require deterministic programmable logic, local buffering, and significant I/O connectivity without moving to larger or more power-hungry devices, this MAX® 10 device provides a clear specification-aligned choice with RoHS compatibility and a documented operating envelope.

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