10M04SAU169A7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 130 193536 4000 169-LFBGA |
|---|---|
| Quantity | 1,010 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-UBGA (11x11) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LFBGA | Number of I/O | 130 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 193536 |
Overview of 10M04SAU169A7G – MAX® 10 FPGA, 4,000 Logic Elements, 169-LFBGA
The 10M04SAU169A7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) IC supplied in a 169‑LFBGA package. It delivers a compact FPGA fabric with 4,000 logic elements, integrated RAM, and 130 user I/Os for embedded system integration.
With an automotive grade and AEC‑Q100 qualification plus an extended operating temperature range and low‑voltage core supply, this device is targeted at applications that require on‑board programmable logic combined with automotive reliability and compact packaging.
Key Features
- Logic Capacity Provides 4,000 logic elements suitable for mid-density programmable logic and glue‑logic integration.
- On‑chip Memory Includes 193,536 total RAM bits to support buffering, small LUTs, and embedded data storage.
- I/O Resources 130 user I/Os give flexible external connectivity for sensors, peripherals, and board‑level interfaces.
- Core Voltage Operates from 1.15 V to 1.25 V, enabling low‑voltage core power domains.
- Package & Mounting Available in a 169‑LFBGA (169‑UBGA, 11×11) surface‑mount package for compact board designs.
- Automotive Qualification & Temperature Range Automotive grade with AEC‑Q100 qualification and an operating range of −40°C to 125°C for temperature‑demanding environments.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Automotive ECU Functions Programmable logic for control functions and peripheral interfacing in automotive electronic control units where AEC‑Q100 qualification is required.
- Sensor and Signal Conditioning On‑chip RAM and abundant I/Os support local preprocessing and aggregation of sensor data in embedded systems.
- In‑vehicle Networking & Bridging Flexible I/O resources allow implementation of protocol bridging, signal routing, and custom interface logic in vehicle systems.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 qualification and an extended −40°C to 125°C operating range provide traceable suitability for automotive applications.
- Balanced integration: 4,000 logic elements combined with 193,536 RAM bits reduce external component count for many embedded tasks.
- Generous I/O count: 130 user I/Os simplify board routing and peripheral connections without additional translators.
- Compact package: 169‑LFBGA (169‑UBGA, 11×11) surface‑mount package supports space‑constrained PCB layouts.
- Low‑voltage core operation: 1.15 V to 1.25 V supply range supports modern low‑power system power domains.
- Regulatory compliance: RoHS compliance streamlines environmental and manufacturing requirements.
Why Choose 10M04SAU169A7G?
The 10M04SAU169A7G positions itself as a mid‑density, automotive‑qualified FPGA solution that combines a practical logic element count with substantial on‑chip RAM and a high I/O count in a compact 169‑LFBGA package. Its AEC‑Q100 qualification and extended temperature range make it appropriate for electronic designs that require automotive reliability without sacrificing board‑level integration.
This part is suitable for designers who need a programmable hardware resource for vehicle systems, sensor interfaces, and embedded control functions where compact packaging, low‑voltage operation, and regulatory compliance are important. The combination of logic, memory, and I/O reduces external parts and supports more integrated, maintainable designs.
Request a quote or submit an inquiry to receive pricing and availability information for the 10M04SAU169A7G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018