10M04SAU324I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 246 193536 4000 324-LFBGA |
|---|---|
| Quantity | 1,374 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-UBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA | Number of I/O | 246 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 250 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 193536 |
Overview of 10M04SAU324I7G – MAX® 10 FPGA (4000 logic elements, 324-LFBGA)
The 10M04SAU324I7G is an Intel MAX® 10 field programmable gate array (FPGA) IC in a 324-LFBGA (15×15) package. It provides 4,000 logic elements, 193,536 bits of on-chip RAM, and up to 246 I/O pins in a surface-mount BGA form factor.
With an industrial grade specification and an operating temperature range of −40 °C to 100 °C, the device is suitable for designs that require moderate logic density, substantial on-chip memory, and a broad I/O count while operating from a 2.85 V to 3.465 V supply.
Key Features
- Logic Capacity – 4,000 logic elements to implement custom digital logic and control functions.
- On‑Chip Memory – 193,536 total RAM bits for buffering, state machines, and small data storage without external memory.
- I/O Density – Up to 246 I/O pins to support multiple external interfaces and peripherals.
- Package – 324‑LFBGA (324‑UBGA, 15×15) surface-mount package for compact board integration.
- Power Supply – Operates from 2.85 V to 3.465 V, enabling compatibility with a range of system voltage rails.
- Industrial Grade – Specified as Industrial grade with an operating temperature range of −40 °C to 100 °C for extended environmental tolerance.
- RoHS Compliant – Manufactured in compliance with RoHS requirements.
Typical Applications
- Industrial Control Systems – Deploy logic, I/O aggregation, and on-chip memory in controls that require an industrial temperature range.
- Embedded Control and Prototyping – Implement custom control logic and state machines using 4,000 logic elements and internal RAM for rapid development.
- I/O‑Intensive Interfaces – Consolidate multiple peripheral interfaces and sensors with up to 246 I/O pins in a single FPGA package.
Unique Advantages
- Balanced Logic and Memory – 4,000 logic elements combined with 193,536 RAM bits provide a strong balance for control-oriented applications without immediate need for external memory.
- High I/O Count – 246 I/O pins reduce the need for external multiplexing and support complex board-level connectivity.
- Industrial Temperature Range – Rated from −40 °C to 100 °C to address applications that operate across wide temperature environments.
- Compact BGA Package – 324‑LFBGA (15×15) package enables dense PCB layouts while delivering substantial I/O and logic capacity.
- Broad Supply Range – 2.85 V to 3.465 V supply compatibility for flexible integration with common system rails.
- Standards Compliance – RoHS compliance supports environmentally conscious product designs.
Why Choose 10M04SAU324I7G?
The 10M04SAU324I7G positions itself as a compact, industrial‑grade MAX® 10 FPGA option that combines moderate logic capacity, significant on‑chip RAM, and a high I/O count in a 324‑LFBGA package. Its specifications make it well suited to embedded and control applications that require reliable operation across −40 °C to 100 °C and compatibility with 2.85 V–3.465 V supply domains.
As part of the Intel MAX® 10 device family, this part is documented within the MAX® 10 FPGA device datasheet, enabling engineers to evaluate electrical, configuration, and timing characteristics for system integration and long‑term design planning.
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