10M04SAU169C8G

The 10M04SAU169C8G is an Intel MAX® 10 field programmable gate array (FPGA) device offering 4,000 logic elements, 193,536 bits of on-chip RAM and 130 general-purpose I/O pins in a compact 169‑LFBGA package. This commercial‑grade device is supplied for surface‑mount assembly and is RoHS compliant.

Designed as a mid-density FPGA option within the MAX 10 family, it provides a balance of logic density, embedded RAM, and I/O count for designs that require integrated programmable logic with defined voltage and temperature operating ranges.

Key Features

• Core Architecture  Intel MAX® 10 FPGA device family—device-level electrical and timing specifications are defined in the MAX 10 datasheet.
• Logic Density  4,000 logic elements and 250 logic array blocks provide mid-range programmable logic capacity.
• On‑Chip Memory  193,536 total RAM bits for embedded data buffering, FIFOs and small memory structures.
• I/O  130 general-purpose I/O pins for flexible interfacing with peripherals and external devices.
• Package and Mounting  169‑LFBGA (supplier package: 169‑UBGA, 11×11) in a surface‑mount form factor suitable for compact board layouts.
• Supply Voltage  Supported supply range: 2.85 V to 3.465 V.
• Operating Temperature  Commercial operating range: 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Device Grade / Speed  Commercial grade; datasheet identifies supported commercial speed grades (including -C8).

Typical Applications

• Embedded control and logic  Use the 4,000 logic elements and on‑chip RAM to implement custom control state machines and glue logic.
• Peripheral interfacing  130 I/Os allow connection to multiple sensors, interfaces, and external peripherals for flexible I/O expansion.
• Prototyping and mid-density designs  Compact 169‑LFBGA packaging and mid-range resources make it suitable for proof‑of‑concept boards and commercial products within the specified temperature and voltage ranges.

Unique Advantages

• Balanced resource mix:  4,000 logic elements paired with 193,536 bits of RAM provides an integrated solution for designs that require both logic and embedded memory.
• High I/O count:  130 I/Os reduce the need for external I/O expanders and simplify board-level interfacing.
• Compact package:  169‑LFBGA (11×11 UBGA) lets you maintain a small PCB footprint while keeping significant programmable resources.
• Commercial temperature rating:  Specified operation from 0 °C to 85 °C aligns with standard commercial product requirements.
• RoHS compliant:  Meets lead‑free compliance expectations for modern electronic assemblies.

Why Choose 10M04SAU169C8G?

This Intel MAX® 10 device delivers a pragmatic combination of logic capacity, embedded RAM and a high I/O count in a surface‑mount 169‑LFBGA package. Its commercial grading and clearly defined electrical and timing specifications make it a practical choice for designers seeking a documented, mid‑density FPGA solution.

10M04SAU169C8G is suited to teams and projects that require predictable resource allocation (logic elements, RAM, and I/Os), compact packaging, and standard commercial temperature operation—providing a stable platform for production designs that rely on the MAX 10 device family documentation.

Request a quote or submit a product inquiry to obtain pricing and availability for 10M04SAU169C8G.